Master Bond Epoxy Adhesive Passes the U.S. Military Standard for Thermal Stability

    Master Bond’s epoxy compounds- EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have been tested and approved for MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material.

    The test indicates a consistent product performance for temperatures up to 200°C.

     Thermogravimetric Analysis (TGA)

    TGA is the study of a material’s weight change as a function of temperature and time under a controlled atmosphere. It can be used to determine the thermal stability of a material.

    MIL-STD-883 section 3.8.5 defines that thermal stability testing should be done by performing a thermogravimetric analysis (TGA) according to ASTM D3850.

     Thermal Stability Test

     To evaluate the thermal stability of a material-

     Samples are placed in a nitrogen atmosphere (20-30mL/min flow).

   The measurement of the samples start at room temperature (25°C) and then continues as the samples get heated 10°C/min up to a final temperature of 200°C.

    During this assessment, the weight of the samples is continuously measured.

    A material passes this standard if the weight loss at 200°C is less than or equal to 1.0 percent of the cured material weight.

    Three samples are tested and the average value of the three must meet or exceed the minimum requirements.

    All six epoxy adhesives sent by Master Bond for the test through an independent lab have passed the MIL-STD-883J, Method 5011 (sect. 3.5.2 & 3.8.5), tested in accordance with ASTM D3850.