Technical Paper - Subcritical debonding is of particular concern for microelectronic packaging, coating, and adhesive applications. Time-dependent subcritical debonding at polymer/substrate interfaces occurs at lower mechanical loads and strain energy release rates compared with those required for catastrophic interface fracture. In this work, the role of organosilane adhesion promoters, 3-aminopropyltriethoxysilane and glycidoxypropyltrimethoxysilane, in subcritical debonding of epoxy/glass interfaces under hygrothermal condition is investigated. The epoxy systems studied included a thermally cured bisphenol F-based epoxy resin and a bisphenol F-based epoxy resin cured with a UV active curing agent. Subcritical debonding results revealed that there are two regions, the threshold strain energy release rate (GTH) and the power law region, observed in subcritical debonding curves. Hygrothermal aging not only lowers the critical debonding driving energy required for debond extension (GC) but also lowers GTH, below which interfacial crack growth does not occur. Interestingly, applying silane adhesion promoters on glass surfaces increased GTH values and decreased debonding growth rate. Therefore, the subcritical debonding growth rate mechanism was found to be sensitive to interface chemistry. An attempt to correlate the results of critical and subcritical debonding was undertaken. It was found that as aging time increased, the role of subcritical debonding became less
Source : EIX 10-52 E20105113498109 NDN- 267-0913-5059-0 AUTHORS- Onjun, Orasa AUTHORS- Pearson, Raymond A. AUTHOR ADDRESS- Bethlehem, PA 18015 EMAIL- rp02@lehigh.edu JOURNAL NAME- The Dillard Collection, Honoring David A. Dillard, who Received The Adhesion Society Award for Excellence in Adhesion Science, Sponsored by 3M, in February 2010, Part 3 ABBREVIATED JOURNAL TITLE- J Adhes VOLUME 86 NUMBER 12 PUBLICATION DATE- December 2010 1178-1202 PAGES 41 REFERENCES DOCUMENT TYPE- Journal Article ISSN- 0021-8464 PUBLICATION DATE- 2010 CODEN- JADNA AUTHOR AFFILIATION- Pearson, R. A.; Center for Polymer Science and Engineering, Lehigh University, Bethlehem, PA 18015, rp02@lehigh.edu, UNITED STATES PUBLISHER- Taylor and Francis Inc., 325 Chestnut St, Suite 800, Philadelphia, PA 19106 PUBLICATION COUNTRY- UNITED STATES JOURNAL NAME- Journal of Adhesion ELECTRONIC JOURNALS DOCUMENT NUMBER- 1545-5823 DOCUMENT URL- 10.1080/00218464.2010.529382 LANGUAGE- English
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