Technical Paper - Subcritical debonding is of particular concern for microelectronic packaging, coating, and adhesive applications. Time-dependent subcritical debonding at polymer/substrate interfaces occurs at lower mechanical loads and strain energy release rates compared with those required for catastrophic interface fracture. In this work, the role of organosilane adhesion promoters,...
Source : EIX 10-52 E20105113498109 NDN- 267-0913-5059-0 AUTHORS- Onjun, Orasa AUTHORS- Pearson, Raymond A. AUTHOR ADDRESS- Bethlehem, PA 18015 EMAIL- rp02@lehigh.edu JOURNAL NAME- The Dillard Collection, Honoring David A. Dillard, who Received The Adhesion Society Award for Excellence in Adhesion Science, Sponsored by 3M, in February 2010, Part 3 ABBREVIATED JOURNAL TITLE- J Adhes VOLUME 86 NUMBER 12 PUBLICATION DATE- December 2010 1178-1202 PAGES 41 REFERENCES DOCUMENT TYPE- Journal Article ISSN- 0021-8464 PUBLICATION DATE- 2010 CODEN- JADNA AUTHOR AFFILIATION- Pearson, R. A.; Center for Polymer Science and Engineering, Lehigh University, Bethlehem, PA 18015, rp02@lehigh.edu, UNITED STATES PUBLISHER- Taylor and Francis Inc., 325 Chestnut St, Suite 800, Philadelphia, PA 19106 PUBLICATION COUNTRY- UNITED STATES JOURNAL NAME- Journal of Adhesion ELECTRONIC JOURNALS DOCUMENT NUMBER- 1545-5823 DOCUMENT URL- 10.1080/00218464.2010.529382 LANGUAGE- English
加载中...
