Patent - High temperature performance hot melt adhesives are formulated for application at low temperatures below, i.e., below 300⁰F. Hot melt adhesives containing low levels of metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesives.
In one embodiment, the low application temperature hot melt adhesive comprises a polyolefin copolymer component and a maleated polyethylene wax component. The polyolefin component comprises two different polyolefin copolymers. At least one polyolefin copolymer is a metallocene-catalyzed ethylene/[alpha]-olef[iota]n copolymer prepared by polymerizing ethylene with an [alpha]- olefin (e.g., butane, hexene, octene) using a metallocene catalytic system, which copolymer has a Melt Index of greater than about 400 g/10 min at 19O⁰C. In one preferred embodiment, the polyolefin copolymer having a Melt Index of greater than about 400 g/10 min at 190⁰C is prepared from ethylene and 1 -octene monomers.
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