Master Bond Introduces Electrically Conductive, Silver Filled Epoxy System

HACKENSACK, NJ -- Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications.

EP3HTSMED

This silver-filled epoxy adhesive/sealant has remarkable electrical conductivity with a volume resistivity less than 0.001 ohm cm. Serviceable over the wide temperature range of -60°F to 400°F, EP3HTSMED is resistant to severe thermal cycling and many chemicals including water, fuels, oil, and most organic solvents.

EP3HTSMED is a thixotropic paste and has a specific gravity of 2.90 at 77°F. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 300°F or 40 to 90 minutes at 250°F. With minimal shrinkage during cure and a Shore D hardness of 60 to 80, EP3HTSMED bonds well to a variety of substrates including metals, glass, vulcanized rubbers, ceramics, and many plastics.

Silver in color, this one component adhesive is packaged in syringes or glass jars. EP3HTSMED has a shelf life of 6 months in a glass jar and a shelf life 3 months when stored in a syringe at room temperature.

Master Bond EP3HTSMED offers exceptional thermal and electrical conductivity while fully meeting USP Class VI requirements. This no mix epoxy adhesive has versatile, rapid cure schedules.