Master Bonds Advanced Epoxy Adhesive EP65HT-1 Meets NASAs Low Outgassing Specifications

Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths approaching 3,000 psi. Service temperature range is 60°F to +400°F. EP65HT-1 offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT-1 has now been qualified to meet NASA low outgassing specifications.

EP65HT-1 bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT-1 has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT-1 is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries.

About Master Bond

Master Bond Inc. was founded in 1976. Their focus has been on developing the best in epoxies, silicones, polyurethanes, polysulfides, UV cures and other specialty adhesive systems. They are true specialists in their field and are recognized by many as the preeminent adhesive formulation company in the world. Master Bond Inc. formulates the highest quality products and offers unmatched technical advice and customer support. Their product line consists of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Each compound is designed to meet specific application needs and requirements.