Aremco-Bond 2318, a new high temperature, thermally conductive, epoxy-potting compound produced by Aremco Products, Inc., is now available for electrical and electronic potting applications from -55 to +185 °C (-67 to 365 °F).
Aremco-Bond 2318 is a medium viscosity, black-pigmented, high temperature epoxy compound used in electrical and electronic applications from ?55 to +185 °C (-67 to 365 °F). Aremco-Bond 2318 provides high flexural strength of 12,300 psi, tensile-shear strength of 1,135 psi, volume resistivity of 3.0 x 1015, dielectric strength of 460 volts/mil, and dielectric constant of 4.8 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.
Aremco-Bond 2318 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 12 parts hardener by weight. Mixed viscosity is 16,000 cP and the life for a 100 gram mass is 2 hours at room temperature. Recommended cure:4 hours at room temperature plus 2 hours at 200 °F. An alternative cure schedule is 24 hours at room temperature. Cured product exhibits a linear shrinkage of .003 in/in and a Shore-D hardness of 89.
Aremco-Bond 2318 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, semiconductors, and electrical feed-thru bushings.
Aremco-Bond 2318 is supplied in easy to mix pint, quart and gallon kits. Please contact Aremcos Technical Sales Department for more information about this advanced product.
Formed in 1965, Aremcos advanced materials division has been a leader in the development and production of technical ceramics, adhesives, coatings, sealants and potting compounds for applications to 3200°F. These materials are used throughout industry in the design of sensors, electrical components and analytical instruments, as well as the maintenance and repair of high temperature process equipment.
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