Epoxy Resin Adhesive cures at temperatures as low as 60°C.

Suited for optical packaging applications where several temperature-sensitive materials are bound together, DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping. This multi-purpose, one-component adhesive can be processed within 48 hr at room temperature and adheres to various plastics as well as metals and FR4 composites. Dispensed through needles with diameter as small as 200μm , product exhibits low thermal stress and moderate shrinkage during curing.