新产品·新技术信息

Aremco推出一个电子用环氧灌封组合物Aremco-Bond 2315

来源：本站原创2015年03月30日

阅读次数：次

Aremco Unveils Aremco-Bond 2315, an Epoxy-potting Compound for Electronics

Aremco-Bond 2315, a new high temperature, thermally conductive, epoxy-potting compound produced by Aremco Products, Inc., is now available for electrical and electronic potting applications to 365 F INSERT INTO [lzx].[dbo].[tb_new]([id],[type],[title],[source],[personal],[image],[contents],[time],[number]) VALUES (185C).

Aremco-Bond 2315 is a low viscosity, black-pigmented, high temperature, epoxy compound used in electrical and electronic applications to 365 F INSERT INTO [lzx].[dbo].[tb_new]([id],[type],[title],[source],[personal],[image],[contents],[time],[number]) VALUES (185C). Additional features include high thermal conductivity, good electrical insulation, and low shrinkage after cure.

Aremco-Bond 2315 provides high flexural strength of 12,300 psi. Electrical properties include a volume resistivity of 1.0 x 1015, dielectric strength of 480 volts/mil, and dielectric constant of 4.7 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bond 2315 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 25 parts hardener by weight. Mixed viscosity is 3,000 cP and the pot life for a 100 gram mass is greater than 8 hours at room temperature. Recommended cure is 2 hours at 160 F plus 2 hours at 300 F. Alternative cure is 6 hours at 250 F. Cured product exhibits a linear shrinkage of .003 in/in and Shore-D hardness of 92.

Aremco-Bond 2315 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, and semiconductors.