Bostik has exhibited smart adhesive solutions for textile and nonwoven applications at Techtextil North America in Atlanta, GA.

　　Adhesives for Nonwoven Bonding Applications

Bostik at Techtextil North America showcased Adhesives for Non-woven bonding application

　　During the event, Bostik showcased its smart web (fusible textile) and hot melt adhesives, which are ideal for a variety of textile and nonwoven bonding applications. Offering broad performance characteristics, these solutions enable manufacturers to improve operational efficiencies and overall product performance.

　　Bostik’s innovative web adhesives offer excellent adhesion to textiles, vinyl and urethane foams and can feature flame retardancy in certain formulations. Contributing to increased consumer safety, these web adhesives are easy to use and enable sustainable manufacturing processes. Additionally, the company’s diverse hot melt product offerings at the show allow manufacturers to address many application bonding needs with a single solution.

　　Innovative and Smart Solutions

　　Speaking of the event, Derek Hofsess, Business Development Engineer, said, “Bostik looks forward to being part of Techtextil again this year. The event provides a valuable opportunity to learn about customer needs and build important relationships, ultimately enabling us to meet market requirements with innovative and smart solutions.

　　Techtextil Along with Texprocess

　　As the region’s only dedicated show for technical textiles and nonwovens, Techtextil was co-located with Texprocess Americas at the Georgia World Congress Center to mark its 15th edition. Techtextil serves as an opportunity for participants in the textile industry to learn about market developments, industry trends and new innovations while attending a vast exhibit hall. Featuring over 500 exhibitors, this year’s Techtextil also provided expanded learning opportunities, including Tech Talks and a joint networking reception with Texprocess Americas attendees.