Master bond’s EP21ND-LP Epoxy Adhesive is formulated for structural bonding applications and features working life of 2-4 hrs at 75°F for a 100 gram mass. Capable to withstand thermal cycling, product exhibits a coefficient of thermal expansion of 50-55 x 10^-6/in/in/°C and electrical insulation with volume resistivity of greater than 10^14 ohm-cm. The adhesive is suitable for use in electronic, electrical, computer, chemical, aerospace and OEM industries and is available in ½ pint, pint, quart and gallon kits.