TAGS:  Epoxy Adhesives    

Applied Graphene Materials (AGM) has announced the launch of two new high performance thermal paste adhesive materials- Genable® 4400 and Genable® 4300.
 

Providing In-situ Thermal Conductivity

AGM has launched of two new high performance thermal paste adhesive for space and electronics components

The new products are supplied to customers as easy to process two part epoxy systems in thermal management applications. They are designed for use either directly as a paste adhesive and gap filler, or as potential base additives to enhance other formulated systems.

The two products have been formulated to deliver different level of processing viscosity to suit specific application requirements and will provide in-situ thermal conductivity in the region of 3-6 W/mK, combined with good levels of lap shear strength.

AGM anticipates applications within formulations for bonding, potting, sealing and encapsulation for Space, Electronics and Automotive components.

Source: Applied Graphene Materials (AGM)