Bostik will present its new line of innovative instant adhesives during a panel discussion at Adhesives & Bonding Expo, held in in Novi, Michigan from 24 March 2020 to 26 March 2020.
New Technology Based Adhesive Offers Low Odor & More Flexibility
The adhesives are based on methoxyethyl cyanoacrylate (MECA) technology, these instant adhesives are low blooming, low odor and more flexible compared to traditional ethyl cyanoacrylate (ECA) technology. During this presentation, Cyrielle Kolbecher, Technical Service Engineer at Bostik, will detail the key distinctions with this technology and how its capabilities enable it to outperform other options. Attendees will learn the application selection criteria, handling and processing for Bostik’s instant adhesives while also discovering its benefits versus ECA solutions.
“With a deep understanding of technology gaps and market needs, we were able to formulate a new line of engineering instant adhesives designed to take product assembly to the next level,” said Kolbecher speaking in advance of her presentation. “I look forward to having the opportunity to detail the value behind this chemistry and how it addresses market needs,” added Kolbecher.
About Bostik
Bostik is one of the leading global adhesive specialists in construction, consumer and industrial markets. The company has been developing innovative adhesive solutions that are smarter and more adaptive to the forces that shape daily lives.