Momentive offers launched SilCool* TIA241GF, a silicone thermally conductive gap filling adhesive, to be distributed by Techsil. SilCool* TIA241GF is ideal for applications that requires heat transfer, low stress, and good interface wetting. The product offers tacky adhesion for applications where movements in x, y, and z directions occur due to vibration, thermal cycling stress and CTE (coefficient of thermal expansion) mismatch.
Reliable Adhesion with Thermal Resistance
The thermal gap filling adhesive is a two-part, soft, thermally conductive silicone material. The non-slumping pasty consistency of the adhesive offers physical stability for optimized processing. SilCool* TIA241GF can be used as liquid dispensed alternative to prefabricated thermal pads, for a broad array of thermal designs in electronic applications.
SilCool* TIA241GF offers reliable adhesion and thermal resistance over competing materials. The gap filling adhesive can be used for automotive applications (e.g. automotive electronic control units and systems) and as a thermal interface for electronic components in automotive, consumer, telecommunication, lighting and industrial devices.
Key Features and Benefits of SilCool* TIA241GF
Good thermal conductivity 4.1 W/mK
Fast and low temperature cure
Convenient 1:1 mix ratio by weight
Retains softness after cure to contribute to stress relief during thermal cycling
Excellent slump resistance (stays in place)
Repairability
Flame retardancy: UL94V-0 equivalent
Glass bead option availability (180 & 250µ) for bond line thickness (BLT) control
Long-term reliability and exceptional performance
Consistent filling of multiple thickness gaps under one common heat sink
Excellent surface wetting
Excellent for maintaining contact through thermal cycling
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