ROARTIS BV launches IQ-BOND 5976-ACE, a fast cure anisotropic conductive adhesive for printed electronics application. The adhesive is used in the assembly of fine pitch radio-frequency identification (RFID) antennas to interconnect the RFID tab onto the RFID antenna.
High Adhesion Strength on Various Flexible and Rigid Substrates
IQ-BOND 5976-ACE addresses the economic challenges of printed electronics by combining high throughput processing requirements with long-term reliability requirements. The adhesive provides high adhesion strength on different flexible and rigid substrates, such as polyethylene terephthalate (PET), polyimide, FR4, copper, aluminum and silver. IQ-BOND 5976-ACE is moisture tested at 85°C/85%RH for 1000 hours and temperature cycle tested at -40°C/+125°C.
The adhesive cures within seconds with thermode- or induction curing systems, enabling to assembly 20.000 – 40.000 microchips per hour on typical, industrial and flip-chip production systems.
加载中...
