加载中...

点击这里给我发消息

QQ群:417857029

新产品·新技术信息

Panacol推出用于印刷电路板的高性能框架填充胶

来源:specialchem2021年03月05日

阅读次数:

  Panacol launches new range of high-performance adhesives for frame-and-fill applications on printed circuit boards. The frame material, Structalit® 5704, is a black, thermally curable and single-component epoxy. The fill material, Structalit® 5717 to Structalit® 5721 has different rheological properties.
  
  Protect Complex Areas on Circuit Boards
  
  Frame-and-fill processes are used to protect highly complex areas on electronic circuit boards. In the first step, a highly viscous barrier – the so-called frame – is applied. In the next step, this area is quickly filled with lower viscosity filler material – the fill. With this precise process, areas on the circuit board can be protected from mechanical impact factors.
  
  The combination of frame-and-fill materials allows the application of minimum barrier and potting heights and cures to a homogeneous coating. Panacol's new frame-and-fill adhesives are perfectly matched so that the frame and fill areas can be optimally dispensed wet-on-wet without the still-liquid adhesives leading to undesired flowing on the PCB.
  
  Bead Stability with High-Glass Transition Temperature
  
  Structalit® 5704 frame and glob top compound feature excellent bead stability and high-glass transition temperature of 150°C up to 190°C, depending on the curing parameters and the layer thicknesses. When using Structalit® 5704, no bleeding effects occur. Due to the very low ion content of less than 20 ppm, Structalit® 5704 is suitable for chip encapsulation on electronic circuit boards.
  
  As a fill material, Panacol has developed a range of adhesives with different rheological properties. The adhesives Structalit® 5717 to Structalit® 5721 are formulated with optimized flow behavior, so that the adhesives can be used on various chip and bonding wire geometries due to the differently adjusted viscosities. Since the fills have the same chemical base as the frame material, the excellent physical and chemical properties of high glass transition range, ion purity, temperature stability and minimal shrinkage behavior are also found in the fillls.
  
  Once cured, Structalit® 5704 and the matching fill of the Structalit® 5717-5721 series form a black, opaque and scratch-resistant coating. These properties together with a temperature resistance of up to 200°C ensure maximum reliability.
  • 标签:
相关阅读

本站所有信息与内容,版权归原作者所有。网站中部分新闻、文章来源于网络或会员供稿,如读者对作品版权有疑议,请及时与我们联系,电话:025-85303363 QQ:2402955403。文章仅代表作者本人的观点,与本网站立场无关。转载本站的内容,请务必注明"来源:林中祥胶粘剂技术信息网(www.adhesive-lin.com)".

网友评论

©2015 南京爱德福信息科技有限公司   苏ICP备10201337 | 技术支持:建站100

客服

客服
电话

1

手机:18114925746

客服
邮箱

565052751@qq.com

若您需要帮助,您也可以留下联系方式

发送邮箱

扫二
维码

微信二维码