Master Bond launches Master Bond LED405FL3, a flexible one component, solvent-free, LED curing adhesive. It offers optical clarity and a refractive index of 1.51. Its flexibility allows for stress minimization especially when bonding substrates with different coefficients of thermal expansion. It also utilizes a fluorescent dye for detection purposes, which enables easy visual inspection. Master Bond LED405FL3 can be also used as a sealant and encapsulating compound.
Resistant to Thermal Cycling & Vibration
This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive.
Master Bond LED405FL3 is serviceable from -100°F to +250°F. It cures with a hardness of around 5-15 Shore D at room temperature. Additional performance properties include electrical insulation as well as resistance to thermal cycling, shock and vibration.
Master Bond LED405FL3 is a low viscosity system that may be used for small potting and encapsulation applications assuming that there are no shadows or concealed areas. This solvent free, RoHS compliant compound is available in syringes, half pint, pint and quart containers.
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