Power Adhesives launches Tecbond 114, a packaging grade to its Tecbond range of hot melts. It is engineered to help businesses reduce their costs without compromising on performance or speed.
Tecbond 114 has been developed for use on uncoated cardboard, making it ideal for carton closing, tray assembly and for use with packaging inserts.
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Reduce cost per carton closure
Developed by Power Adhesives based on customer feedback, cost-effective Tecbond 114 enables businesses to reduce the cost per carton closure. Its fast-setting speed and strong initial bond help manufacturers to reduce adhesive usage per box, while increasing production efficiency.
Available in 12mm, 15mm and 43mm shaped formats, Tecbond 114 delivers best results when used with the Tec range of hot melt applicators.
Alex Zulewski, commercial director commented, “Tecbond 114 is a great addition to our range of hot melts for packaging. As a customer-focused manufacturer, we’ve listened to the market and created a great cost-effective option, while still delivering strength and performance.”
“We’re proud to be able to offer such a comprehensive range that caters for all customers, including good quality products that are keenly priced for the packaging market, next to cutting edge biodegradable hot melts for packaging.”
CHIRA-approved biodegradable HMAs
Power Adhesives recently expanded its biodegradable range of hot melts, introducing three new adhesives aimed primarily at packaging. Tecbond 902B-PL, Tecbond 351B-PR and Tecbond 351B-PR were launched in January, which sit alongside original biodegradable formulations Tecbond 214B and Tecbond 110B-PR.
All Tecbond biodegradable grades comply with EN 13432 and ASTM D6400, ensuring they biodegrade fully under industrial composting conditions without leaving microplastics or harmful residues. The full range of grades has also achieved CHIRA assessment approval, confirming that they are benign within paper recycling streams and have no adverse effects on the pulping or recovery process.
All products are suitable for use in high-speed packaging environments and precision manufacturing, offering reliable adhesion to a wide variety of substrates.
Tecbond 114 is the latest hot melt to be added to the Tecbond packaging range, offering customers a comprehensive choice of adhesives to suit their needs.
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