Modified epoxy resin conductive adhesive used for LED chip packaging
Inventor(s): WANG XIAODONG：
Application number: CN20141615134 20141105
Abstract of CN105623585 (A)：
The invention discloses a modified epoxy resin conductive adhesive used for LED chip packaging. The modified epoxy resin conductive adhesive comprises the following raw materials by mass percentage: 20-25% of modified epoxy resin, 30-45% of nano silver powder, 10-15% of nano copper powder, 10-15% of silicon dioxide, 5-8% of zinc stearate, 1-2.5% of a coupling agent, 2-3% of a plasticizer, 1-2% of a curing agent, 0-1% of a curing accelerator, and 0-8% of diluents. According to the modified epoxy resin conductive adhesive used for LED chip packaging, by adding nano silver powder and nano copper powder with different proportion in the conductive adhesive, a proper of the modified epoxy resin is cooperated, high heat conductivity and high conductivity are realized, the modified epoxy resin conductive adhesive has superior performance, has good heat conduction and conductive effects, and can fully satisfy the usage requirement of high-brightness large-power LED chips.