Flexible conductive adhesive based on modified epoxy resin  

（一种基于改性环氧树脂的柔韧性导电胶黏剂）

Inventor(s): WANG XIAODONG

Priority number(s)(专利检索号): CN20141615420 20141105

Abstract of  CN105623579 (A)：

The invention discloses a flexible conductive adhesive based on modified epoxy resin. The flexible conductive adhesive comprises the following components by mass percentage: 15-30% of modified epoxy resin, 40-60% of nano silver powder, 5-8% of tin oxide, 5-8% of magnesium oxide, 3-6% of a flexible additive, 0-2% of toluene, 2-4% of silica gel, 0.5-1.5% of a coupling agent, and 0.5-1.5% of a curing agent. By adding the flexible additive, the flexibility of a conductive adhesive matrix is increased, and mechanical property is increased, network density formed by the flexible additive and epoxy resin is suitable for current conduction, so that the flexibility of the conductive adhesive is increased, at the same time, resistivity of the conductive adhesive is reduced. The flexibility of the conductive adhesive solves the problem of cracking of a substrate and an element in packaging, and the conductive adhesive is especially suitable for an electronic packaging technology in microelectronic industry.