SILICONE RESIN COMPOSITION FOR SEALANT AND POWER SEMICONDUCTOR MODULE THAT USES THIS COMPOSITION

一种用于功率半导体模块的硅树脂密封胶的制备方法

United States Patent Application 20160333239

Inventors: HIGASHIDATE; Makoto; ICHIMURA; Yuji

Abstract：

A silicone resin composition is provided that exhibits an increased adhesiveness relative to insulating circuit substrates and can prevent bubble production even when moisture absorption has occurred, exhibits an excellent heat resistance, and is free of problems such as cracking. A silicone resin composition for use as a sealant for a power semiconductor module includes an insulating circuit substrate having a Cu layer formed on a surface thereof. The silicone resin composition is formed on the Cu layer of the insulating circuit substrate, and has, after curing, a penetration of 35 to 70 and an adhesive strength of 50 to 180 kPa between the silicone resin composition and the insulating circuit substrate. The penetration is measured in accordance with JIS K 2220.