Epoxy resin composition for copper-clad board and application thereof  

（一种覆铜板用环氧树脂组合物及其应用）

Inventor(s): XU YING; FANG KEHONG

Priority number(s): CN20151483582 20150803

Abstract of  CN105086365 (A)：

The invention relates to an epoxy resin composition for a copper-clad board and an application thereof. The epoxy resin composition comprises flame retardant additives containing phosphorus and flame retardant additives containing bromine and can be used for preparing prepreg and copper-clad laminated boards. According to the epoxy resin composition for the copper-clad board and the application thereof, brominated polystyrene, decabromodiphenyl ethane and the like are adopted to serve as sources of the bromine, phosphazene, melamine polyphosphate, aluminum metaphosphate or melamine cyanurate and the like serve as sources of the phosphorus, the proportion of the flame retardant additives containing the phosphorus and the flame retardant additives containing the bromine of the composition is adjusted to make the bromine content controlled between 5% and 12% and make the phosphorus content controlled between 0.2% and 1.5%, and the flame retardancy of the composition can reach grade UL94 V-0; compared with a pure-bromine flame-retardant copper-clad board, the heat resistance is higher, and a higher CTI value can be reached; compared with a pure-phosphorus flame-retardant copper-clad board, the rate of moisture absorption is lower, and the adhesive property and the technological operability which are needed for printing circuit substrates can be provided; compared with a traditional board which has a high CTI and adopts a large amount of aluminum hydroxide, by means of the epoxy resin composition for the copper-clad board, the CTI can reach to be above 600 V by utilizing a small amount of the aluminum hydroxide or not utilizing the aluminum hydroxide at all.