纳米层级结构MnO₂结构调控策略及其催化氧化挥发性有机化合物的研究进展

刘佳丽，梁晨曦，吴松华，王煜洁

（北京航空材料研究院股份有限公司，北京 100094）

【摘  要】系统地综述了纳米层级结构MnO₂的构建策略，包括形貌与缺陷调控、晶相调控及复合结构设计。重点探讨了层级结构MnO₂在催化氧化挥发性有机化合物（VOCs，如甲醛、苯系物）中的应用，揭示了具体反应中影响催化活性的结构特征。最后，针对实际应用中面临的稳定性不足、抗中毒性差及规模化制备等难题，提出了未来的发展方向，为高效催化材料开发提供理论指导。

【关键词】MnO₂；纳米层级结构；挥发性有机化合物；催化氧化；综述

生物基原料用于电子行业用聚氨酯胶的研究进展

徐玉文，刘良军

（东莞优邦材料科技股份有限公司，广东东莞  523837）

【摘 要】系统地综述了生物基原料用于电子行业用聚氨酯胶的研究进展，包括单组分反应型聚氨酯热熔胶和双组分聚氨酯胶。首先，介绍了常见的单组分反应型聚氨酯热熔胶和双组分聚氨酯胶的反应机理，配方主要组分多元醇、异氰酸酯及相应助剂的生物基研究进展；再详细阐述了生物基原料，如蓖麻油、大豆油、菜籽油、棕榈油、桐油等生物基多元醇以及生物基异氰酸酯和非异氰酸酯，作为聚氨酯胶原材料的应用潜力；然后对生物基原料对电子行业用单组分反应型聚氨酯热熔胶和双组分聚氨酯胶的性能表现进行了全面分析，如粘接强度、耐热性、耐湿性、绝缘性等关键性能指标；最后，对生物基原料用于电子行业用聚氨酯胶的未来发展趋势进行了展望，指出未来的研究方向将集中在提高性能、降低成本、拓展应用领域以及加强产业化发展等方面，为生物基聚氨酯胶在电子行业的广泛应用提供理论支持和技术参考。

【关键词】生物基原料；单组分反应型聚氨酯热熔胶；双组分聚氨酯胶；电子行业

SBC热熔压敏胶在热塑性聚烯烃基材上的热老化机理研究

王瑾瑞，姚奕佳，陈  楠，曾益龙，丁红梅，方  凯，刘志维，王  崇，徐大洲

（北京东方雨虹防水技术股份有限公司，先进防水材料全国重点实验室，北京  101300）

【摘  要】设计了由苯乙烯嵌段共聚物（SBC）、增黏树脂和环烷油组成的热熔压敏胶（HMPSA）的基础配方，并将其涂布在热塑性聚烯烃（TPO）基材上得到自黏TPO卷材。以增黏树脂的种类作为单一变量，考察了5种软化点均在100 ℃附近的增黏树脂对HMPSA的黏度、软化点、流变行为、粘接性能的影响，并进一步跟踪了5种增黏树脂配方（HDCPD、A-HDCPD、HC5、HC9和RE）制备的自黏TPO卷材在80 ℃下热老化7 d过程中粘接性能、流变行为和化学成分的变化。研究结果表明：⑴对比5种不同增黏树脂制备的HMPSA配方老化前后的剥离强度可知，在80 ℃下热老化7 d后，HDCPD配方的剥离强度衰减程度最大，衰减率为48%；HC5配方衰减程度最小，衰减率为13%；RE配方剥离强度相对无处理反而提升了20%，但相对最高值（热老化1 d后的剥离强度）衰减了26%。⑵红外光谱结果表明，热老化前后HMPSA的化学成分并未发生明显变化，氧化降解并不是造成HMPSA剥离强度下降的主要原因。⑶4种石油树脂（HDCPD、A-HDCPD、HC5和HC9）配方体系的HMPSA，热老化过程中剥离强度持续衰减，同时在流变曲线上表现为玻璃化转变温度（T_g）持续向低温区移动，流动点（T_flow）向高温区移动，储能模量（G’）上升；松香树脂RE配方体系的HMPSA较为特殊，剥离强度随热老化进行先上升后下降，且T_g先上升随后趋于稳定，G’持续上升。流变性能和剥离性能的变化规律呈现出良好的相关性，说明配方中增黏树脂和环烷油组分的迁移是热老化剥离强度下降的主要原因。⑷流变分析结果表明，5种增黏树脂向TPO基材中的迁移倾向从小到大依次为：RE＜HC5<A-HDCPD<HC9<HDCPD。⑸热老化过程中，HMPSA中的增黏树脂向TPO基材迁移的趋势受树脂与SIS相容性和TPO相容性的共同影响，与SIS相容性越差同时与TPO相容性越好，越容易发生迁移；反之，则越不容易发生迁移。

【关键词】热熔压敏胶；热塑性聚烯烃；热老化；流变行为；迁移

纳米填料增强聚脲胶粘剂的高温粘接性能

古云松¹，张  平¹，吴冶平²，张银宇²

（1.西南科技大学，四川绵阳  621010；2.中国工程物理研究院化工材料研究所，四川绵阳  621900）

 【摘  要】本研究通过引入纳米填料来限制高分子链的运动，以提高聚脲胶粘剂在高温下的粘接强度。重点分析了不同纳米填料对聚脲胶粘剂的热稳定性和线性热膨胀系数的影响。研究结果表明：⑴特定含量的纳米填料可以显著提高聚脲样品的热稳定性，尤其是在添加量为10%的白炭黑或氨基化碳纳米管时，能在50~150 ℃的范围内有效地降低线性热膨胀系数。⑵白炭黑的添加在一定程度上增强了聚脲样品的热稳定性，但对于粘接性能的提升作用并不明显。⑶当添加量为15%的氨基化碳纳米管时，在80和130 ℃下都展现出卓越的粘接性能，粘接性能的提升最为显著，对304不锈钢表现出较佳的粘接效果。这些发现为聚脲胶粘剂在高温环境下的应用提供了重要的理论依据和试验支持。

【关键词】纳米填料；聚脲胶粘剂；热稳定性；线性热膨胀系数；高温粘接性能

离子液体改性环氧导电胶的制备及性能研究

赵丁伟，刘  钊，孟思琦，金泽珠，朱舒燕，刘  昊，陈丽敏，崔志远

（北京中天鹏宇科技发展有限公司，北京  100854)

【摘  要】采用四乙二醇二甲醚和四氟硼酸锂合成了一种溶剂化离子液体（ILs），并利用红外光谱对其结构进行表征。然后用合成的离子液体与双酚A型环氧树脂、固化剂、银粉以及其他助剂共混，制备了环氧导电胶。探讨了ILs质量分数对导电胶黏度、热稳定性、力学性能及导电性能的影响。研究结果表明：⑴通过对溶剂化离子液体进行红外光谱分析，证明离子液体合成成功，且没有新物质的产生；通过差示扫描量热法证实，合成的溶剂化离子液体可以促进环氧树脂开环反应，可缩短固化时间，提升固化效率；扫描电子显微镜微观形貌分析进一步证实，离子液体可以促进树脂固化收缩，形成更加致密稳定的交联密度网络，促进银粉在环氧树脂基质中的分散，并形成了均一混合物。⑵电学性能分析表明，随着ILs质量分数不断增加，导电胶的体积电阻率呈现先降低后升高的趋势。ILs可以促进更高的固化收缩，使银粉固化收缩更加紧密，促进导电通路的形成，扫描电镜试验结果也证实这一点。但过量的ILs可能对游离环氧基团固化反应产生阻碍作用，导致固化不完全，树脂收缩率降低，体积电阻率增加。⑶力学性能测试结果表明，随着ILs质量分数的不断增大，导电胶的芯片剪切强度和搭接拉伸强度呈现先升高后降低的趋势，并在ILs质量分数为15%时达到最大。⑷热学性能测试结果表明，离子液体的加入提高了导电胶的玻璃化转变温度，同时降低了线性热膨胀系数。玻璃化转变温度和线性热膨胀系数与聚合物网络分子链结构、交联密度切相关，ILs促进环氧树脂形成致密且稳定的三维网络结构，提高了热学性能。⑸综上，当溶剂化离子液体在树脂体系中的质量分数为15%时，导电胶具有较佳的综合性能。由于离子液体具有许多优异的优点，展现出离子液体在导电胶制备领域潜在的应用前景。

【关键词】溶剂化离子液体；导电胶；热学性能；电学性能；力学性能

瓦楞纸箱用包装胶的耐高温剪切性能研究及配方优化

陈楚雄¹，李  爽¹，张修鹏¹，徐  峰¹，张恬婧^1,2，刘兴海²

（1.襄阳市鸿琰实业有限责任公司，湖北襄阳 441002；2.武汉大学电子信息学院，湖北武汉 430064)

【摘  要】为了解决工业生产中白胶受温度影响大，在纸箱生产使用时易出现脱粘弹开、胶液飞溅等不良现象，瓦楞纸箱用包装胶在保持原有黏度的同时，应拥有耐高温剪切性能和流变性能。本文以醋酸乙烯酯共聚乳液为主要原料，利用煅烧高岭土和硼酸分别作为增强剂和交联剂，使用聚醚类消泡剂，制备得到了具有耐高温剪切性能的包装胶。采用单因素变量法分别研究了高岭土、硼酸、水和加料方式等因素对胶液黏度和胶膜强度的影响。同时，结合响应面试验法，以黏度和胶膜强度为响应值观察拐点，研究了配方中影响较大的组分对高温高剪切下的黏度、胶膜强度的影响，并结合实际生产筛选出最优配方。研究结果表明：改性胶的最佳配方为，高岭土质量分数为2%，硼酸质量分数为0.227%，水质量分数为4.498%。试验结果与模型优化预测结果相近，表明基于响应面法的设计试验具有现实意义，并验证了响应面法用于瓦楞纸箱用包装胶的耐高温剪切性能研究及配方优化的可行性。

【关键词】硼酸；高岭土；响应面；包装胶；耐高温；剪切性能

紫外固化聚丙烯酸酯医用导电胶的制备和性能研究

范延超，宫静榕，朱冬玲，栾伟伟

（河北康臣生物科技有限公司，河北邯郸  056200）

【摘  要】以水溶性单体2-丙烯酰胺基-2-甲基丙磺酸（AMPS）作为聚合主体，以1,2-丙二醇作为增溶剂、N,N-亚甲基双丙烯酰胺作为交联剂、碳酸钾作为中和剂、氯化钾作为电性能增强剂、导电钛白粉作为辅助导电剂、2-羟基-4’-(2-羟乙氧基)-2-甲基苯丙酮作为光引发剂制成的导电胶液，经过涂布及UV固化机固化，可直接制成医用导电胶，并对其结构和性能进行表征。研究结果表明：⑴傅里叶变换红外光谱仪和热裂解气相色谱质谱联用仪分析其结构后认为，已经成功制备了目标产物。⑵AMPS用量小时，水性聚丙烯酸酯导电胶的结构强度小，导致测试180°剥离力时胶层发生内部结构撕裂，180°剥离力小；而当AMPS用量过大时，胶粘剂的结构太强，压敏胶不容易贴敷到钢板上，也导致180°剥离力小。选择AMPS质量分数为40%时，胶粘剂的性能相对较好。⑶增塑剂1,2-丙二醇在低用量时，可以给胶层提供弹性形变，使胶层与基材的表面更充分接触，剥离力随1,2-丙二醇用量增加而升高；但当1,2-丙二醇用量过高时，界面处易发生内聚破坏（胶层内部断裂），导致剥离力下降。选择1,2-丙二醇的配比为21.2%，作为最终配方。⑷在交联剂N,N-亚甲基双丙烯酰胺低用量时，可增强胶层内聚力，且随着用量增大而剥离力增大；但用量过大时交联网络过于致密，分子链运动受阻，致使剥离力降低，剥离面易发生突发性界面分离。选择交联剂质量分数为0.13%，作为最终工艺配方。⑸在筛选的相对最优条件下，采用2-羟基-4’-(2-羟乙氧基)-2-甲基苯丙酮作为胶液的引发剂、氯化钾作为导电剂、纳米级高纯导电钛白粉作为辅助导电剂，可以使最终制成的医用导电胶具有优良的心电性能。⑹经过55 ℃恒温30天，或者-20 ℃冷冻7天处理后，上述配方导电胶制成的心电电极的心电性能、黏附力基本保持不变，表明该导电胶具有较好的耐候性。

【关键词】聚丙烯酸酯；导电胶；紫外固化；医用

壳聚糖/PVA/纳米SiC复合膜制备及力学性能研究

张伟刚¹，苏心如²，田清泉²

（1.西安瑞联新材料股份有限公司，陕西西安  710077；2.渭南师范学院化学与材料学院，陕西渭南  714099）

【摘  要】以纳米SiC为增强体，丙三醇/聚乙二醇为增塑剂，通过流延成型法制备了壳聚糖/聚乙烯醇(PVA)/纳米SiC复合膜。分别考察了增塑剂和纳米SiC的添加量对复合膜的结构、力学性能的影响。研究结果表明：⑴增塑剂能增强共混膜上的氢键作用强度，并且随着纳米SiC的增加，共混膜中的交联反应有所减少。⑵增塑剂增强了复合膜内交联反应，破坏了复合膜原有的晶体结构，形成新的交联网状结构，从而降低了复合膜的结晶度。通过对比壳聚糖/PVA和SiC的XRD图，表明成功制备了复合膜。⑶增塑剂及纳米SiC的添加均提高了复合膜的力学性能。当增塑剂添加量为20%时，复合膜的力学性能较好。当纳米SiC的添加量为0.02~0.03 g时，复合膜的拉伸强度较大，最高达到37.2 MPa，断裂伸长率达到136%。⑷复合膜的吸水率随纳米SiC含量增加而呈现先增大后降低的变化趋势，纳米SiC颗粒的添加改变了复合膜吸水基团的亲水性。

【关键词】壳聚糖；PVA；纳米SiC；增塑剂；复合膜；制备；力学性能

聚丙烯材料粘接用底涂剂的制备

陈海桂¹，张志文¹，边 峰¹，周亚民²，彭 敏²

（1.广东普赛达材料科技股份有限公司，广东东莞 523646；2.东莞理工学院化学工程与能源技术学院，广东东莞 523808）

【摘 要】以二吗啉二乙基醚（DMDEE）、氯化聚丙烯、KH-560、KH-570和硅烷树脂等为原料，制备了不同氯化聚丙烯和硅烷树脂用量的底涂剂。讨论了氯化聚丙烯、硅烷树脂和施工温度对聚丙烯材料粘接性能的影响。研究结果表明：⑴氯化聚丙烯的加入对聚丙烯材料的粘接有促进作用，但随着用量继续增加，底涂剂体系的黏度变大，导致其涂刷性变差，影响到底涂剂对基材表面的浸润和渗透能力，使得氯化聚丙烯与聚丙烯材料之间的相互作用力减弱，从而导致剪切强度和粘接内聚破坏的降低。⑵硅烷树脂的加入增加了聚丙烯材料表面的活性，并引入了活性基团。但是当硅烷树脂浓度过大时，影响底涂剂对聚丙烯材料表面的润湿，从而影响到底涂剂对聚丙烯材料的粘接效果。⑶在施工温度为-5和0 ℃时，涂刷性变差，影响底涂剂对基材表面的浸润和渗透能力，从而影响到底涂剂对聚丙烯材料的粘接效果。施工温度在5 ℃以上时，底涂剂对聚丙烯材料的剪切内聚破坏≥90%。⑷综上所述，当w(氯化聚丙烯)=3%，w(硅烷树脂)=12%（相对于底涂剂总质量而言），且施工温度在5 ℃以上时，制备的底涂剂对聚丙烯材料的粘接性能较好。

【关键词】聚丙烯；粘接；硅烷树脂；底涂剂

Research progress on the structural control strategies of nano-hierarchical structure MnO₂ and its catalytic oxidation of volatile organic compounds

Liu Jiali, Liang Chenxi, Wu Songhua, Wang Yujie

(BAIMTEC Material Co., Ltd., Beijing 100094, China)

【Abstract】A systematic review was conducted on the construction strategies of nano-hierarchical structure MnO₂, including morphology and defect control, crystal phase control, and composite structure design. The application of hierarchical structure MnO₂ in the catalytic oxidation of volatile organic compounds (VOCs) such as formaldehyde and benzene derivatives was explored, revealing the structural characteristics that affect catalytic activity in specific reactions. Finally, in response to the challenges faced in practical applications such as insufficient stability, poor anti toxicity, and large-scale preparation, future development directions were proposed to provide theoretical guidance for the development of efficient catalytic materials.

【Keywords】MnO₂; nano-hierarchical structure; volatile organic compounds; catalytic oxidation; review

Research progress of bio-based raw materials for polyurethane adhesive in the electronics industry

Xu Yuwen, Liu Liangjun

(Dongguan U-Bond Material Technology Co., Ltd., Dongguan523837, Guangdong, China)

【Abstract】A systematic review was conducted on the research progress of bio-based materials for polyurethane adhesive used in the electronics industry, including single component reactive polyurethane hot melt adhesive and two-component polyurethane adhesive. Firstly, the reaction mechanisms of common single component reactive polyurethane hot melt adhesive and two-component polyurethane adhesive, as well as the bio-based research progress of the main components of the formula, i.e. polyols, isocyanates, and corresponding additives were introduced. The application potential of bio-based raw materials, such as castor oil, soybean oil, rapeseed oil, palm oil, tung oil, and other bio-based polyols, as well as bio-based isocyanates and non isocyanates, as polyurethane adhesive materials were further elaborated. Then, a comprehensive analysis was conducted on the performance of bio-based raw materials on single component reactive polyurethane hot melt adhesive and two-component polyurethane adhesive used in the electronics industry, including key performance indicators such as bonding strength, heat resistance, moisture resistance, and insulation. Finally, the future development trend of using bio-based raw materials for polyurethane adhesive in the electronics industry was discussed, and it was pointed out that future research directions would focus on improving performance, reducing costs, expanding application areas, and strengthening industrial development, which provide theoretical support and technical references for the widespread application of bio-based polyurethane adhesive in the electronics industry.

【Keywords】bio-based raw materials; single component reactive polyurethane hot melt adhesive; two-component polyurethane adhesive; electronics industry

Study on the thermal aging mechanism of SBC hot melt pressure sensitive adhesive on thermoplastic polyolefin substrate

Wang Jinrui, Yao Yijia, Chen Nan, Zeng Yilong, Ding Hongmei, Fang Kai, Liu Zhiwei, Wang Chong, Xu Dazhou

(State Key Laboratory of Advanced Waterproof Materials, Beijing Oriental Yuhong Waterproof Technology Co., Ltd., Beijing 101300, China)

【Abstract】A basic formulation for hot melt pressure sensitive adhesive (HMPSA) composed of styrene block copolymer (SBC), tackifier resin, and cyclic oil was designed, and it was coated on thermoplastic polyolefin (TPO) substrate to obtain the self-adhesive TPO roll. Using the type of tackifierresin as a single variable, the effects of five types of tackifier resins with softening points around 100 ℃ on the viscosity, softening point, rheological behavior, and bonding properties of HMPSA were investigated. Furthermore, the changes in bonding properties, rheological behavior, and chemical composition of self-adhesive TPO rolls prepared with five types of tackifier resin formulations during thermal aging at 80 ℃ for 7 d were further tracked. The research results showed that, ⑴Comparing the peel strength of HMPSA formulations prepared with 5 different tackifierresins before and after aging, it could be seen that after thermal aging at 80 ℃ for 7 d, the peel strength of HDCPD formulation decreased the most, with an attenuation rate of 48%. The HC5 formulation had the smallest degree of attenuation, with an attenuation rate of 13%. The peel strength of RE formulation increased by 20% compared to no treatment, but the highest value (peel strength after 1 d of thermal aging) decreased by 26%. ⑵ The infrared spectroscopy results showed that there was no significant change in the chemical composition of HMPSA before and after thermal aging, and oxidative degradation was not the main reason for the decrease in HMPSA peel strength. ⑶ The HMPSA of four petroleum resin formulations (HDCPD, A-HDCPD, HC5, and HC9) showed a continuous decrease in peel strength during thermal aging, while the rheological curve showed a continuous shift of glass transition temperature (T_g) towards the low temperature zone, a shift of flow point (T_flow) towards the high temperature zone, and an increase in storage modulus (G'). The HMPSA of rosin resin RE formulation system was quite unique, with peel strength first increasing and then decreasing with thermal aging, and T_g first increasing and then stabilizing, while G' continued to increase. The changes in rheological and peel properties showed a good correlation, indicating that the migration of tackifier resin and cyclic oil components in the formulation was the main reason for the decrease in thermal aging peel strength.⑷ The rheological analysis results indicated that the migration tendency of five tackifierresins into the TPO substrate, from small to large, was as follows: RE＜HC5<A-HDCPD<HC9<HDCPD.⑸ During the thermal aging process, the tendency of the tackifierresin in HMPSA to migrate into the TPO substrate was influenced by both the compatibility of the resin with SIS and TPO. The poorer the compatibility with SIS, the better the compatibility with TPO, making migration more likely to occur. On the contrary, migration was less likely to occur.

【Keywords】hot melt pressure sensitive adhesive; thermoplastic polyolefin; thermal aging; rheological behavior; migration

High-temperature bonding performance of nano filler enhanced polyurea adhesive

Gu Yunsong¹, Zhang Ping¹, Wu Yeping², Zhang Yinyu²

(1.Southwest University of Science and Technology, Mianyang 621010, Sichuan, China;2.Institute of Chemical Materials, China Academy of Engineering Physics, Mianyang  621900, Sichuan, China)

【Abstract】Nano fillers were introduced in this study to restrict the movement of polymer chains and improve the bonding strength of polyurea adhesive at high temperature. The influence of different nano fillers on the thermal stability and linear coefficient of thermal expansion of polyurea adhesive was analyzed in details. The research results showed,⑴ Specific content of nano fillers could significantly improve the thermal stability of polyurea samples, especially when adding 10% white carbon black or aminated carbon nanotubes, which could effectively reduce the linear coefficient of thermal expansion in the range of 50-150 ℃. ⑵ The addition of white carbon black enhanced the thermal stability of polyurea samples to a certain extent, but its effect on improving bonding performance was not significant. ⑶ When the amount of aminated carbon nanotubes added was 15%, excellent bonding performance was exhibited at 80 and 130 ℃, with the most significant improvement in bonding performance, showing excellent bonding effect on 304 stainless steel. These findings provided important theoretical basis and experimental support for the application of polyurea adhesive in high-temperature environments.

【Keywords】nano filler; polyurea adhesive; thermal stability; linear coefficient of thermal expansion; high-temperature bonding performance

Preparation and performance study of ionic liquid modified epoxy conductive adhesive

Zhao Dingwei, Liu Zhao, Meng Siqi, Jin Zezhu, Zhu Shuyan, Liu Hao, Chen Limin, Cui Zhiyuan

（Beijing SanTel Technology & Trading Corp., Beijing  100854, China）

【Abstract】A solvated ionic liquid (ILs) was synthesized by using tetraethylene glycol dimethyl ether and lithium tetrafluoroborate, and its structure was characterized by infrared spectroscopy. Then, the epoxy conductive adhesive was prepared by blending the synthesized ILs with bisphenol A-type epoxy resin, curing agent, silver powder, and other additives. The influence of ILs mass fraction on the viscosity, thermal stability, mechanical properties, and conductivity of conductive adhesive was investigated. The research results showed that, ⑴Infrared spectroscopy analysis of solvated ionic liquid proved the successful synthesis of ionic liquid without the generation of new substances. It was confirmed by differential scanning calorimetry that the synthesized solvated ionic liquid could promote the ring opening reaction of epoxy resin, shorten the curing time, and improve the curing efficiency. Scanning electron microscopy microstructure analysis further confirmed that ionic liquid could promote resin curing shrinkage, form a denser and more stable crosslinking density network, promoting the dispersion of silver powder in the epoxy resin matrix, and forming a homogeneous mixture. ⑵Electrical performance analysis showed that as the mass fraction of ILs increased, the volume resistivity of conductive adhesive showed a trend of first decreasing and then increasing. ILs could promote higher curing shrinkage, making silver powder curing shrinkage more compact and promoting the formation of conductive pathways, as confirmed by scanning electron microscope test results. However, excessive ILs might hinder the curing reaction of free epoxy groups, resulting in incomplete curing, reduced resin shrinkage, and increased volume resistivity. ⑶The mechanical performance test results showed that with the continuous increase of ILs mass fraction, the chip shear strength and lap tensile strength of conductive adhesive showed a trend of first increasing and then decreasing, and reached their maximum at an ILs mass fraction of 15%. ⑷The thermal performance test results showed that the addition of ionic liquid increased the glass transition temperature of conductive adhesive, while reducing the linear coefficient of thermal expansion. The glass transition temperature and linear coefficient of thermal expansion were related to the molecular chain structure and crosslinking density of the polymer network. ILs promoted the formation of a dense and stable three-dimensional network structure of epoxy resin, improving its thermal properties. ⑸ Overall, the conductive adhesive modified with 15% ionic liquid in the resin system exhibited the excellent comprehensive performance. Due to the many excellent advantages of ionic liquid, it had shown potential application prospects in the field of conductive adhesive preparation.

【Keywords】solvated ionic liquid; conductive adhesive; thermal performance; electrical performance; mechanical performance

Research on high-temperature resistance shear properties of packaging adhesive for corrugated carton and formulation optimization

Chen Chuxiong¹, Li Shuang¹, Zhang Xiupeng¹,

Xu Feng¹, Zhang Tianjing^1,2, Liu Xinghai²

(1.Xiangyang Hongyan Industrial Co., Ltd., Xiangyang  441002, Hubei, China; 2. Electronic Information School, Wuhan University, Wuhan 430064, Hubei, China)

【Abstract】In order to solve the problem of white glue being greatly affected by temperature in industrial production, which is prone to debonding, elastic opening, and splashing of adhesive during the production of cardboard boxes, the packaging adhesive used for corrugated carton should have high-temperature resistance shear properties and rheological properties while maintaining its original viscosity. In this paper, vinyl acetate copolymer emulsion was used as the main raw material, calcined kaolin and boric acid were used as reinforcing agent and crosslinking agent respectively, and polyether defoamer was used to prepare packaging adhesive with high-temperature resistance shear properties. The single factor variable method was used to study the effects of factors such as kaolin, boric acid, water, and feeding method on the viscosity of adhesive solution and the adhesive film strength. At the same time, combined with the response surface test method, the inflection pointwas observed with viscosity and adhesive film strength as response values, and the influence of the components with significant influence in the formulation on viscosity and adhesive film strength under high temperature and high shear was studied, and then the optimal formulation was selected based on actual production. The research results showed that the optimal formulation for modified adhesive was 2% kaolin, 0.227% boric acid, and 4.498% water. The experimental results were similar to the model optimization prediction results, indicating that the design experiment based on response surface methodology had practical significance, and verifying the feasibility of using response surface methodology to study the high-temperature resistance shear properties and formulation optimization of packaging adhesive for corrugated carton.

【Keywords】boric acid; kaolin; response surface; packaging adhesive; high-temperature resistance; shear property

Preparation and properties of UV-curable polyacrylate medical conductive adhesive

Fan Yanchao, Gong Jingrong, Zhu Dongling, Luan Weiwei

(Hebei Kangchen Biotechnology Co., Ltd., Handan 056200, Hebei, China)

【Abstract】Using water-soluble monomer 2-acrylamido-2-methylpropanesulfonic acid (AMPS) as the main polymer, 1,2-propanediol as the solubilizer, N,N-methylbisacrylamide as the crosslinking agent, potassium carbonate as the neutralizing agent, potassium chloride as the electrical performance enhancer, conductive titanium dioxide as the auxiliary conductive agent, and 2-hydroxy-4'- (2-hydroxyethoxy)-2-methylphenylacetone as the photoinitiator, the conductive adhesive solution was prepared. After coating and UV curing, it could be directly made into medical conductive adhesive, and its structure and properties were characterized. The research results showed that, ⑴After analyzing its structure using Fourier transform infrared spectroscopy and pyrolysis gas chromatography-mass spectrometry, it was believed that the target product had been successfully prepared. ⑵ When the dosage of AMPS was small, the structural strength of water-based polyacrylate conductive adhesive was low, which led to internal structural tearing of the adhesive layer when testing 180° peel force, resulting in low 180° peel force. When the amount of AMPS used was too large, the structure of the adhesive was too strong, and the pressure sensitive adhesive was not easy to adhere to the steel plate, which also led to low 180° peel force. When selecting AMPS mass fraction of 40%, the performance of the adhesive was relatively good. ⑶ When the dosage of plasticizer 1,2-propylene glycol was low, it could provide elastic deformation to the adhesive layer, making the surface of the adhesive layer more fully in contact with the substrate, and the peel force increased with the increase of 1,2-propylene glycol dosage. But when the dosage of 1,2-propylene glycol was too high, cohesive failure (internal fracture of the adhesive layer) was prone to occur at the interface, resulting in a decrease in peel force. The ratio of 21.2% for 1,2-propylene glycol was selected as the final formula. ⑷ At low dosage of crosslinking agent N,N-methylene bisacrylamide, the cohesion of the adhesive layer could be enhanced, and the peel force increased with increasing dosage. However, when the dosage was too large, the cross-linked network became too dense, hindering the movement of molecular chains, resulting in a decrease in peel force, and the peeling surface was prone to sudden interface separation. The crosslinking agent mass fraction of 0.13% was selected as the final process formula. ⑸ Under the relatively optimal screening conditions, using 2-hydroxy-4'- (2-hydroxyethoxy)-2-methylphenylacetone as the initiator of the adhesive solution, potassium chloride as the conductive agent, and nanoscale high-purity conductive titanium dioxide as the auxiliary conductive agent, the final medical conductive adhesive could have excellent electrocardiographic properties. ⑹ After being treated with a constant temperature of 55 ℃ for 30 days or frozen at -20 ℃ for 7 days, the electrocardiographic performance and adhesion of the electrocardiogram electrode made with the above formula conductive adhesive remained basically unchanged, indicating that the conductive adhesive had good weather resistance.

【Keywords】polyacrylate; conductive adhesive; UV curing; medical

Preparation and mechanical properties of chitosan/PVA/nano SiC composite film

Zhang Weigang¹, Su Xinru², Tian Qingquan²

(1.Xi'an Manareco New Materials Co., Ltd., Xi'an  710077, Shaanxi, China;2.College of Chemistry and Materials Science, Weinan Normal University, Weinan  714099,Shaanxi, China)

【Abstract】Chitosan/polyvinyl alcohol (PVA) /nano SiC composite film was prepared by flow casting method using nano SiC as reinforcement and glycerol/polyethylene glycol as plasticizer.The effects of adding plasticizer and nano SiC on the structure and mechanical properties of composite film were investigated separately. The research results showed that, ⑴Plasticizer could enhance the strength of hydrogen bonding on the composite film, and with the increase of nano SiC, the cross-linking reaction in the composite film was reduced. ⑵Plasticizer enhanced the cross-linking reaction within the composite film, disrupted the original crystal structure of the composite film, and formed a new cross-linked network structure, thereby reducing the crystallinity of the composite film. By comparing the XRD patterns of chitosan/PVA and SiC, it was shown that the composite film had been successfully prepared. ⑶ The addition of plasticizer and nano SiC improved the mechanical properties of the composite film. When the amount of plasticizer added was 20%, the mechanical properties of the composite film were optimal. When the amount of nano SiC added was 0.02-0.03 g, the tensile strength of the composite film was relatively high, reaching a maximum of 37.2 MPa, and the elongation at break reached 136%. ⑷ The water absorption rate of the composite film showed a trend of first increasing and then decreasing with the increase of nano SiC content, and the addition of nano SiC particles changed the hydrophilicity of the water absorbing groups in the composite film.

【Keywords】chitosan; PVA; nano SiC; plasticizer; composite film; preparation; mechanical property

Preparation of primer for bonding polypropylene material

Chen Haigui¹, Zhang Zhiwen¹, Bian Feng¹, Zhou Yamin², Peng Min²

(1.Guangdong Pustar Adhesives and Sealants Co., Ltd., Dongguan 523646, Guangdong, China; 2.School of Chemical Engineering and Energy Technology, Dongguan University of Technology, Dongguan  523808, Guangdong, China)

【Abstract】A primer with different amounts of chlorinated polypropylene and silane resin was prepared by using 2,2'-dimorpholinyldiethyl ether (DMDEE), chlorinated polypropylene, KH-560, KH-570, and silane resin as raw materials. The influence of chlorinated polypropylene, silane resin, and construction temperature on the bonding properties of polypropylene material was discussed. The research results showed that, ⑴ The addition of chlorinated polypropylene had a promoting effect on the bonding of polypropylene material, but as the dosage continued to increase, the viscosity of the primer system increased, resulting in poor coating performance and affecting the wetting and penetration ability of the primer on the substrate surface. This weakened the interaction force between chlorinated polypropylene and polypropylene material, leading to a decrease in shear strength and cohesive failure of the adhesive. ⑵The addition of silane resin increased the surface activity of polypropylene material and introduced active groups. However, when the concentration of silane resin was too high, it affected the wetting of the surface of polypropylene material by the primer, thereby affecting the bonding effect of the primer on polypropylene material. ⑶At construction temperatures of -5 and 0 ℃, the coating performance deteriorated, affecting the wetting and penetration ability of the primer on the substrate surface, thereby affecting the bonding effect of the primer on polypropylene material. When the construction temperature was above 5 ℃, the shear cohesive failure of the primer on polypropylene material was ≥ 90%. ⑷ In summary, when w(chlorinated polypropylene)=3%, w(silane resin)=12% (relative to the total mass of the primer), and the construction temperature was above 5 ℃, the prepared primer had excellent bonding performance to polypropylene material.

【Keywords】polypropylene; bonding; silane resin; primer