高性能压敏胶粘剂的研究进展

邢文旭，刘彩召，张绪刚，孙明明，张 斌

(黑龙江省科学院石油化学研究院，黑龙江哈尔滨  150040)

【摘  要】压敏胶粘剂作为一种重要功能粘接材料，广泛应用于电子、汽车和包装等领域。本文系统总结了不同种类压敏胶的研究进展，涵盖了丙烯酸酯、有机硅、天然橡胶、热熔型及聚氨酯类压敏胶的结构特性、性能改进和改性方法，分析了其分子结构与黏附性能之间的关系。同时，探讨了新型改性技术在压敏胶性能提升中的应用。最后，展望了压敏胶的未来发展趋势，重点关注可持续性、智能化及多功能化研究方向，希望对高性能压敏胶粘剂的设计开发提供理论基础和实践指导。

【关键词】压敏胶粘剂；丙烯酸酯；有机硅；研究进展

仿生智能黏附界面的研究现状

周建伟¹，姚燕生¹，阚宏林^2,3

(1.安徽建筑大学机械与电气工程学院，安徽合肥  230601；2.安徽工程大学人工智能学院，安徽芜湖  241000；3.安徽正阳机械科技有限公司，安徽六安  237000)

【摘  要】智能黏附界面，尤其是按需切换黏附力的界面，在可穿戴设备、机器人和生物检测等领域展现出巨大的应用潜力。本文聚焦于三种代表性仿生对象——壁虎、树蛙和章鱼，利用JKR模型、毛细管湿黏附模型和吸力负压模型分别解释三者黏附机制，并系统剖析了仿生可切换黏附领域（如攀爬机器人、软夹具和可穿戴设备等）的多种仿生智能黏附界面以及研究现状。最后对仿生智能黏附界面的未来发展进行了展望。

【关键词】可切换黏附；仿生智能黏附界面；微纳米结构

片银/球银复配对导电胶性能的影响

桑广艺，蒋 超，龚文圣，来立锋，陶小乐，何永富

（杭州之江有机硅化工有限公司，浙江杭州 311200）

【摘 要】采用环氧树脂、环氧稀释剂、固化剂、固化促进剂、偶联剂、导电助剂以及3倍前述质量的银粉（不同片银/球银比例），制备了导电胶（ECA），并从流变性能、热物理性能、导电性能、导热性能、形貌以及粘接强度几个方面研究了微米片银/微米球银复配对ECA性能的影响。研究结果表明：⑴黏度和触变指数受球银的占比影响很大，球银占比越高，黏度越小，触变指数越小。片银对提高ECA触变性有明显影响，而球银能有效降低黏度。⑵随着球银比例增加，玻璃化转变温度（T_g）发生轻微变化，对T_g前的热膨胀系数（CTE-1）影响不大，对T_g后的热膨胀系数（CTE-2）则有明显的降低作用。⑶在银粉总含量不变的情况下，球银对体积电阻率的降低不利，但能明显提升ECA的热导率。⑷添加的银粉整体呈现出均匀分布的特征，且具有一定的随机性和无序性。随着球银含量的增加，其在片银平面方向的填充密度由疏松逐渐趋于致密，同时片银被球银遮蔽的程度也相应提高。随着球银比例的进一步增加，大量的球银填充于片银平面垂直方向的间隙中，有利于构建各向同性的高效导热网络。⑸球银相对片银具有更紧密的堆积效果，机械补强效果随着球银含量的提升而得到体现，并且在球银含量达到1/3时，出现最佳粘接强度。

【关键词】导电胶；热导率；玻璃化转变温度；热膨胀系数

导电助剂与稀释剂类型对LED固晶胶性能的影响

蒋  超，桑广艺，宋  琦，李龙发，龚文圣，陈  丹，陶小乐，何丹薇

（杭州之江有机硅化工有限公司，浙江杭州  311200）

【摘  要】LED固晶胶的导电、导热以及耐热可靠性对于大功率LED的发光性能与长期可靠性至关重要。本文采用环氧树脂、稀释剂、固化剂、固化促进剂、偶联剂、导电助剂和银粉等制备了LED固晶胶，然后通过改变导电助剂、稀释剂的种类，制备了不同的样品（E0~E4、R1~R5）。考察了导电助剂种类对LED固晶胶黏度、体积电阻率及导热性能的影响，并探究了稀释剂种类对LED固晶胶的常温及高温芯片推力、芯片-镀银框架残胶率及耐湿热性能的影响。研究结果表明：⑴导电助剂的加入，能够显著降低固晶胶的黏度。当导电助剂为己二酸（二元羧酸），固晶胶体积电阻率显著降低，热导率明显提升；当导电助剂中同时包含羧基和羟基时，体积电阻率反而增加，热导率降低。⑵分子刚性强（R4）、交联密度高（R5）的稀释剂，高温推力和残胶率表现不佳；单官刚性较强的苯基稀释剂（R1），在常温/高温芯片推力及残胶率间取得优异的平衡性能；柔性较好的脂肪族二缩水甘油醚稀释剂（R2、R3），综合性能介于两者之间。⑶高温蒸煮湿热老化试验表明，稀释剂中疏水性较好的苯基基团有助于改善固晶胶的耐湿热性能。

【关键词】LED；固晶胶；可靠性；粘接强度；残胶率；导电助剂；稀释剂

布敦岩复合改性沥青灌缝胶的制备与性能研究

王园明，赵  苏

（沈阳建筑大学材料科学与工程学院，辽宁沈阳  110168）

【摘  要】本研究将布敦岩沥青与其他改性剂复合，制备了一种复合改性沥青灌缝胶。其中选用布敦岩沥青（BRA）、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)聚合物、橡胶粉、增容剂、增塑剂和增黏剂对基质沥青进行复合改性，采用6因素3水平正交试验设计，以路面灌缝胶的常规性能作为评价指标，通过极差分析法和方差分析法探究了各因素对灌缝胶性能的影响程度，研究布敦岩复合改性沥青灌缝胶的最佳配合比。通过布氏旋转黏度试验确定了灌缝胶的最佳施工温度，采用室内试验模拟评价了灌缝胶的储存老化性能，采用扫描电镜观察了灌缝胶与骨料界面的粘接情况。研究结果表明：通过正交试验极差分析和方差分析结果可知，布敦岩沥青和SBS对路面灌缝胶的常规性能均具有显著影响，布敦岩复合改性沥青灌缝胶满足路面灌缝胶技术指标要求（JT/T 740—2015）中高温型灌缝胶的要求。布敦岩沥青和SBS聚合物对于复合改性沥青灌缝胶的性能影响相比其他因素较大，布敦岩复合改性沥青灌缝胶的最佳配比（质量分数比）为，m(基质沥青)∶m（布敦岩沥青）∶m（SBS）：m（废胶粉）∶m(增容剂)∶m(增塑剂)∶m(增黏剂)=100∶16∶8∶20∶10∶2∶2。布敦岩复合改性沥青灌缝胶的最佳施工温度为195.5 ℃，现场储存时间不应超过12 h。通过扫描电镜设备发现，布敦岩复合改性沥青灌缝胶与骨料界面的粘接性良好。

【关键词】布敦岩沥青；改性沥青；灌缝胶

加固用定向碳纤维板拉伸性能标准解析与测试方法探究

安绍都^1,2，马亚楠^1,2，张铭轩^1,2，姚淑芳^1,2，闫雨婷^1,2，闫新宇^1,2，曾  兵^1,2

(1.中国建筑科学研究院有限公司，北京 100013；2.建研院检测中心有限公司，北京 100013)

【摘 要】由环氧树脂浸润硬化形成的加固用定向碳纤维板是纤维增强复合材料中的一种关键材料，其拉伸性能对结构的安全性与耐久性有着重要的意义。本文比较和分析了国内外碳纤维板材相关标准的拉伸性能检测方法和技术指标，考察了对碳纤维板拉伸性能测试结果产生影响的因素，初步探索了不同厂家、不同厚度的碳纤维板拉伸性能检测数据，对有关碳纤维板的拉伸性能测试方法的检测技术进行了评价。

【关键词】碳纤维板；拉伸性能；标准；测试技术

硅烷改性聚硫代醚密封剂的制备和影响研究

彭峪清¹，郭青钊²，吴松华¹

（1.北京航空材料研究院股份有限公司，北京  100095；2.中国商用飞机有限责任公司上海飞机设计研究院，上海  201210）

【摘  要】通过使用异氰酸酯基硅烷偶联剂（KH-901）对液体聚硫代醚橡胶进行封端反应，得到了一种硅烷封端的聚硫代醚橡胶（SPSR）结构，并制备了对应的单组分湿固化聚硫代醚密封剂材料。通过红外光谱和核磁共振手段分析了封端反应的效果，并对比了不同种类的交联剂、不同种类的催化剂对单组分湿固化聚硫代醚密封剂固化行为的影响，最后分析了填料体系对单组分湿固化聚硫代醚密封剂性能的影响。研究结果表明：⑴结构表征表明封端反应进行完全，成功制备了目标产物。⑵（3-氨基丙基）三甲氧基硅烷和巯丙基三甲氧基硅烷可以使得密封剂在较快的速度下完成固化，且其力学性能也较强，都可以作为单组分湿固化聚硫代醚密封剂的交联剂使用。综合考虑，最终选用了固化表现最好的（3-氨基丙基）三甲氧基硅烷作为密封剂的交联剂。⑶随着交联剂用量的增加，单组分湿固化密封剂的拉伸强度和断裂伸长率均呈现先增大后减小的趋势。当w(交联剂)=5%时，密封胶的力学性能相对最佳。⑷二月桂酸二丁基锡作为单组分湿固化密封剂的催化剂，催化效率较为适中且稳定。⑸纳米碳酸钙作为填料的加入可以补强单组分湿固化密封剂，提升其力学性能。但若填料添加量过多，反而会导致力学性能下降。随着纳米碳酸钙的含量增加，密封剂的黏度也在逐渐增大，流淌性下降，说明纳米碳酸钙的加入对密封剂的施工效果存在影响。

【关键词】硅烷改性；聚硫代醚；密封剂；交联剂；催化剂；填料

机房施工用改性酚醛树脂胶粘剂制备及应用性能研究

黄思圣

（中铁二十三局集团第六工程有限公司，重庆  400010）

【摘  要】机房作为电子设备密集的场所，对温度和湿度的控制要求极高。为应对机房复杂多变的施工环境，需要采用具有良好耐热性与耐老化性的胶粘剂材料。一般的酚醛树脂胶粘剂很难在高温、高湿等恶劣环境下保持稳定的粘接性能，对此，研究机房施工用改性酚醛树脂胶粘剂的制备及应用性能就显得尤为重要。通过聚醚多元醇、环氧树脂及二羟甲基丙酸等材料，制备出PU/PA纳米粒子作为改性剂。随后，利用苯酚与丁酮等原料合成了基础酚醛树脂，并分别向其中掺入了10%、15%、20%及25%比例的PU/PA纳米粒子，制成了4种不同改性剂添加量的酚醛树脂胶粘剂。为全面评估这些胶粘剂的应用性能，采用了多样化的测试方法进行了试验分析。研究结果表明：在热稳定性、抗折性、抗压性、抗剪性、抗冲击性、耐磨损性、抗侵蚀性及施工性能测试中，纳米粒子浓度与性能呈现“先升后降”的非线性关系。20%浓度为性能拐点，超过该浓度后，因粒子团聚导致性能衰减；低于该浓度时，因粒子不足无法形成有效增强网络。20%浓度的试样中，均匀分散的纳米粒子可形成三维网络结构，显著提升热稳定性、力学性能及耐磨损性。因此添加20%的PU/PA纳米粒子改性酚醛树脂胶粘剂具有良好的应用性能，有利于提升机房设施的整体质量和耐久性。

不同助剂对环氧树脂与聚酰胺树脂固化体系的力学性能影响研究

盘茂东，朱 璐，冯星朗

（阳江市伟艺抛磨材料有限公司，广东阳江  529500）

【摘 要】本文研究了4种不同助剂（酚醛胺固化剂T-31、固化促进剂DMP-30、硅烷偶联剂KH-560及钛酸酯偶联剂NDZ-201）添加量对环氧树脂与聚酰胺树脂固化体系力学性能的影响，通过对比固化物力学性能的变化来分析助剂的作用。研究结果表明：加入T-31的固化体系的压缩强度持续增大，弯曲强度持续增大，拉伸强度先增大后减小（T-31的质量分数为2.53%时达峰值），剪切强度出现下降，而材料的硬度未发生显著变化。加入DMP-30的固化体系的压缩强度逐渐减小，弯曲强度逐渐增大，拉伸强度在1.25%时最大，剪切强度出现下降，而材料的硬度在1.25%时达到最大值，随后逐渐减小并趋于稳定。加入KH-560的固化体系的压缩强度、拉伸强度随含量增加逐渐减小，弯曲强度在2.53%时最小，剪切强度出现下降，而材料的硬度呈现逐渐降低的趋势。加入NDZ-201的固化体系的压缩强度、弯曲强度随助剂含量增大而减小，拉伸强度在2.53%时最小，剪切强度出现下降，而材料的硬度未发生显著变化。因此，助剂的最佳用量需根据其功能定位、性能目标及特定树脂固化体系综合确定。

【关键词】环氧树脂；聚酰胺树脂；力学性能；助剂；固化

四甲基联苯二酚缩水甘油醚的研制

熊高虎^1,2，张 亮^1,2，瞿  鹏^1,2，刘伊武¹

[1.东方飞源（山东）电子材料有限公司，山东淄博  256300；2.四川东树新材料有限公司，四川德阳  618000]

【摘 要】四甲基联苯二酚缩水甘油醚（TMDE）具有较高的玻璃化转变温度，耐热性能优异，广泛应用于复合材料、电子封装材料以及非线性光学材料等领域。但是国内TMDE的生产技术尚不完善，产品主要以进口为主。本文介绍了一种四甲基联苯二酚（TMBP）和TMDE的制备方法，并分别给出制备TMBP的最佳反应条件和由TMBP制备TMDE的最佳反应条件。研究结果表明：⑴通过结构表征等方法可证明，成功合成了TMBP和TMDE。⑵当氧气流速为4.48 L/h（2,6-二甲基苯酚与通入氧气总质量比值为12∶1）、反应温度为80 ℃时，TMBP的收率最高为93.8%。⑶当反应配比m(环氧氯丙烷)∶m(TMBP)=2.82∶1、反应温度为62 ℃、反应压力为20 kPa时，TMDE产品的指标和消耗最优。

【关键词】四甲基联苯二酚缩水甘油醚；电子封装材料；反应条件

Research progress of high performance pressure sensitive adhesive

Xing Wenxu, Liu Caizhao, Zhang Xugang, Sun Mingming, Zhang Bin

(Institute of Petrochemistry, Heilongjiang Academy of Sciences, Harbin 150040, Heilongjiang, China)

【Abstract】Pressure sensitive adhesive, as an important functional bonding material, is widely used in electronics, automotive, and packaging industries. The research progress of different types of pressure sensitive adhesive, covering the structural characteristics, performance improvement, and modification methods of acrylate, silicone, natural rubber, hot melt and polyurethane pressure sensitive adhesive was systematically summarized in this article, and the relationship between their molecular structures and adhesion properties was analyzed. At the same time, the application of new modification technologies in improving the performance of pressure sensitive adhesive was explored. Finally, the future development trends of pressure sensitive adhesive were discussed, with a focus on sustainability, intelligence, and multifunctionality research directions. It was hoped that this would provide theoretical basis and practical guidance for the design and development of high performance pressure sensitive adhesive.

【Keywords】pressure sensitive adhesive; acrylate; silicone; research progress

Research status of biomimetic intelligent adhesion interface

Zhou Jianwei¹, Yao Yansheng¹, Kan Honglin^2,3

(1.School of Mechanical and Electrical Engineering, Anhui Jianzhu University, Hefei 230601, Anhui, China; 2.School of Artificial Intelligence, Anhui Polytechnic University, Wuhu  241000, Anhui, China; 3.Anhui Zhengyang Mechanical Technology Co., Ltd., Lu'an  237000, Anhui, China)

【Abstract】The intelligent adhesion interface, especially the interface that switches adhesion force on demand, has shown great potential for applications in wearable devices, robots, and biological detection. Three representative biomimetic objects—gecko, tree frog, and octopus were focused in this article. The JKR model, capillary wet adhesion model, and suction negative-pressure model were used to explain the adhesion mechanisms of three objects, and the various biomimetic intelligent adhesion interfaces and research status in the field of biomimetic switchable adhesion (such as climbing robot, soft fixture, and wearable device) were systematically analyzed. Finally, the future development of biomimetic intelligent adhesion interface was discussed.

【Keywords】switchable adhesion; biomimetic intelligent adhesion interface; micro-nanostructure

Influence of the mixing of flake silver/sphere silver on the performance of electrically conductive adhesive

Sang Guangyi, Jiang Chao, Gong Wensheng, Lai Lifeng, Tao, Xiaole, He Yongfu

(Hangzhou Zhijiang Silicone Chemical Co., Ltd., Hangzhou 311200, Zhejiang, China)

【Abstract】An electrically conductive adhesive (ECA) was prepared by using epoxy resin, epoxy diluent, curing agent, curing accelerator, coupling agent, conductive additive, and three times of the aforementioned mass of silver powder (different ratios of flake silver/sphere silver). The influence of micro flake silver /micro sphere silver compounding on the performance of ECA was studied from several aspects of rheological properties, thermophysical properties, electrical conductivity, thermal conductivity, morphology, and bonding strength. The research results showed that, ⑴ The viscosity and thixotropy index were greatly affected by the proportion of sphere silver. The higher the proportion of sphere silver, the lower the viscosity and thixotropy index. Flake silver had a significant effect on improving ECA thixotropy, while sphere silver could effectively reduce viscosity. ⑵As the proportion of sphere silver increased, the glass transition temperature (T_g) underwent a slight change, with little effect on the coefficient of thermal expansion (CTE-1) before T_g, but a significant decrease in the coefficient  of thermal expansion (CTE-2) after T_g. ⑶ Under the condition of fixed total content of silver powder, sphere silver was not conducive to reducing the volume resistivity, but it could significantly improve the thermal conductivity of ECA. ⑷The added silver powder exhibited a uniform distribution as a whole, and had a certain degree of randomness and disorder. As the content of sphere silver increased, its filling density in the direction of flake silver gradually became denser from loose, and the degree of shielding of flake silver by sphere silver also increased accordingly. As the proportion of sphere silver increased further, a large amount of sphere silver filled the gaps in the vertical direction of flake silver, which was beneficial for constructing an isotropic and efficient thermal conductivity network. ⑸Sphere silver had a tighter stacking effect compared to flake silver, and the mechanical reinforcement effect was reflected with the increase of sphere silver content. The optimal bonding strength occurred when the sphere silver content reached 1/3.

【Keywords】electrically conductive adhesive; thermal conductivity; glass transition temperature; coefficient of thermal expansion

Influence of conductive additive and diluent type on the properties of LED die attach adhesive

Jiang Chao, Sang Guangyi, Song Qi, Li Longfa, Gong Wensheng, Chen Dan, Tao Xiaole, He Danwei

(Hangzhou Zhijiang Silicone Chemical Co., Ltd., Hangzhou 311200, Zhejiang, China)

【Abstract】The electrical conductivity, thermal conductivity, and heat resistance reliability of LED die attach adhesive are crucial for the luminescence performance and long-term reliability of high-power LED. LED die attach adhesive was prepared in this article by using epoxy resin, diluent, curing agent, curing accelerator, coupling agent, conductive additive, and silver powder. Then, different samples (E0-E4, R1-R5) were prepared by changing the types of conductive additive and diluent. The influence of conductive additive type on the viscosity, volume resistivity, and thermal conductivity of LED die attach adhesive was investigated, and the influence of diluent type on die shear force at the room temperature and high temperature, residual adhesive rate of chip-silver plating frame, and moisture and heat resistance of LED die attach adhesive were explored. The research results showed that, ⑴ The addition of conductive additive could significantly reduce the viscosity of die attach adhesive. When the conductive additive was adipic acid (dicarboxylic acid), the volume resistivity of die attach adhesive significantly decreased and the thermal conductivity significantly increased. When both carboxyl and hydroxyl groups were present in the conductive additive, the volume resistivity increased, while the thermal conductivity decreased. ⑵ For diluents with strong molecular rigidity (R4) and high crosslinking density (R5), they exhibited poor performance in high-temperature die shear force and residual adhesive rate. For phenyl diluent (R1) with strong rigidity, it achieved excellent balance performance between room temperature/high temperature die shear force and residual adhesive rate. For aliphatic diglycidyl ether diluents (R2, R3) with good flexibility, their comprehensive performance was between the two.⑶ The high-temperature steaming and moisture and heat aging test showed that the hydrophobic phenyl group in the diluent helped improve the moisture and heat resistance of die attach adhesive.

【Keywords】LED; die attach adhesive; reliability; bonding strength; residual adhesive rate; conductive additive; diluent

Preparation and performance study of Buton rock composite modified asphalt grouting adhesive

Wang Yuanming, Zhao Su

（School of Materials Science and Engineering, Shenyang Jianzhu University, Shenyang  110168, Liaoning, China）

【Abstract】A composite modified asphalt grouting adhesive was prepared by combining Buton rock asphalt with other modifiers in this study. Among them, Buton rock asphalt (BRA), styrene-butadiene-styrene block copolymer (SBS) polymer, rubber powder, compatibilizer, plasticizer, and tackifier were selected for composite modification of matrix asphalt. A six-factor three-level orthogonal experimental design was adopted, and the conventional performance of pavement grouting adhesive was used as the evaluation index. The influence of various factors on the performance of grouting adhesive was explored through range analysis and variance analysis, and the optimal mixing ratio of Buton rockcomposite modified asphalt grouting adhesive was studied. The optimal construction temperature of the grouting adhesive was determined through the Brookfield rotational viscosity test. The storage aging performance of the grouting adhesive was evaluated through indoor test simulation. The bonding between the grouting adhesive and the aggregate interface was observed using scanning electron microscopy. The research results showed that through the analysis of range and variance in orthogonal experiment, it could be concluded that both Buton rock asphalt and SBS had a significant impact on the conventional performance of pavement grouting adhesive. Buton rock composite modified asphalt grouting adhesive met the technical requirements (JT/T 740—2015) for high temperature grouting adhesive. Compared with other factors, the performance of composite modified asphalt grouting adhesive was greatly affected by Buton rock asphalt and SBS polymer. The optimal ratio (mass fraction ratio) of Buton rock composite modified asphalt grouting adhesive was, m(matrix asphalt)∶m(Buton rock asphalt)∶m(SBS)∶m(waste rubber powder)∶m(compatibilizer)∶m(plasticizer)∶m(tackifier)=100∶16∶20∶10∶2∶2. The optimal construction temperature of grouting adhesive was 195.5 ℃, and the on-site storage time was ≤12 h. Through scanning electron microscopy equipment, it was found that the bonding between the Budun rock composite modified asphalt grouting adhesive and the aggregate interface was good.

【Keywords】Buton rock asphalt; modified asphalt; grouting adhesive

Analysis of tensile performance standards and testing methods for reinforced oriented carbon fiber plate

An Shaodu^1,2, Ma Yanan^1,2,Zhang Mingxuan^1,2, Yao Shufang^1,2, Yan Yuting^1,2, Yan Xinyu^1,2, Zeng Bing^1,2

(1.China Academy of Building Research Co., Ltd., Beijing 100013, China；2.CABR Testing Center Co., Ltd., Beijing  100013, China)

【Abstract】The reinforced oriented carbon fiber plate formed by infiltration hardening of epoxy resin is a key material in fiber reinforced composite materials, and its tensile performance is of great significance for the safety and durability of the structure. The tensile performance testing methods and technical indicators of carbon fiber plate related standards at home and abroad were compared and analyzed in this article, the factors that affected the tensile performance testing results of carbon fiber plate were investigated, the tensile performance testing data of carbon fiber plate with different thicknesses from different manufacturers were preliminarily explored, and the testing techniques related to the tensile performance testing methods of carbon fiber plate were evaluated.

【Keywords】carbon fiber plate; tensile property; standard; testing technique

Preparation and influence of silane modified polythioether sealant

Peng Yuqing¹, Guo Qingzhao², Wu Songhua¹

（1.BAIMTEC Material Co., Ltd., Beijing  100095, China; 2.COMAC Shanghai Aircraft Design & Research Institute, Shanghai  201210, China)

【Abstract】A silane terminated polythioether rubber (SPSR) structure was obtained by using isocyanate-based silane coupling agent (KH-901) to perform end capping reaction on liquid polythioether rubber, and the corresponding one-component moisture cured polythioether sealant material was prepared.The effect of end capping reaction was analyzed by infrared spectroscopy and nuclear magnetic resonance, and the influence of different types of crosslinking agent and different types of catalyst on the curing behavior of one-component moisture cured polythioether sealant was compared. Finally, the influence of filler system on the performance of one-component moisture cured polythioether sealant was analyzed.The research results showed that, ⑴The structural characterization indicated that the end capping reaction was complete and the target product was successfully prepared. ⑵(3-aminopropyl) trimethoxysilane and mercaptopropyl trimethoxysilane could cure the sealant at a faster speed and had strong mechanical properties. They could both be used as crosslinking agents for one-component moisture cured polythioether sealant. After comprehensive consideration, the best curing performance of (3-aminopropyl) trimethoxysilane was ultimately selected as the crosslinking agent for the sealant.⑶ With the increase of crosslinking agent dosage, the tensile strength and elongation at break of one-component moisture cured sealant showed a trend of first increasing and then decreasing. When w(crosslinking agent)=5%, the mechanical properties of the sealant were relatively optimal. ⑷ Dibutyltin dilaurate, as a catalyst for one-component moisture cured sealant, had moderate and stable catalytic efficiency.⑸ The addition of nano calcium carbonate as a filler could reinforce one-component moisture cured sealant and enhance their mechanical properties. But if the amount of filler added was too much, it would actually lead to a decrease in mechanical properties. As the content of nano calcium carbonate increased, the viscosity of the sealant gradually increased and the flowability decreased, indicating that the addition of nano calcium carbonate had an impact on the construction effect of the sealant.

【Keywords】silane modification; polythioether; sealant; crosslinking agent; catalyst; filler

Preparation and application properties of modified phenolic resin adhesive for computer room construction

Huang Sisheng

(China Railway 23rd Bureau Group Sixth Engineering Co., Ltd., Chongqing 400010, China)

【Abstract】As a place with a high concentration of electronic devices, the computer room has extremely high requirements for temperature and humidity control. In order to cope with the complex and ever-changing construction environment of the computer room, it is necessary to use adhesive materials with good heat resistance and aging resistance. It is difficult for ordinary phenolic resin adhesive to maintain stable bonding performance in harsh environments such as high temperature and high humidity. Therefore, it is particularly important to study the preparation and application performance of modified phenolic resin adhesive for computer room construction.PU/PA nanoparticles were prepared as modifiers by using materials such as polyether polyols, epoxy resin, and dihydroxymethyl propionic acid.Subsequently, basic phenolic resin was synthesized by using raw materials such as phenol and butanone, and PU/PA nanoparticles were added at ratios of 10%, 15%, 20%, and 25%, respectively, to produce phenolic resin adhesive with four different levels of modifier addition. In order to comprehensively evaluate the application performance of these adhesives, diverse testing methods were used for experimental analysis. The research results showed that, in the testing of thermal stability, flexural resistance, compressive resistance, shear resistance, impact resistance, wear resistance, erosion resistance, and construction performance, the concentration of nanoparticles showed a non-linear relationship of "first increasing and then decreasing" with performance. The 20% concentration was the performance inflection point, beyond which the performance deteriorated due to particle aggregation, below this concentration, an effective enhancement network could not be formed due to insufficient particles.In the sample of 20% concentration, uniformly dispersed nanoparticles could form a three-dimensional network structure, significantly improving thermal stability, mechanical properties, and wear resistance. Therefore, adding 20% PU/PA nanoparticles modified phenolic resin adhesive had good application performance, which was conducive to improving the overall quality and durability of computer room facilities.

【Keywords】computer room construction; modified phenolic resin; adhesive; nanoparticles; flexural strength; curing time

Research on the influence of different additives on the mechanical properties of epoxy resin and polyamide resin curing system

Pan Maodong, Zhu Lu, Feng Xinglang

（Yangjiang Weiyi Polishing Material Co., Ltd., Yangjiang  529500, Guangdong, China )

【Abstract】The effects of the contents of four different additives (phenolic amine curing agent T-31, curing accelerator DMP-30, silane coupling agent KH-560, and titanate coupling agent NDZ-201) on the mechanical properties of epoxy resin and polyamide resin curing system were investigated in this article. The effects of additives were analyzed by comparing the changes in mechanical properties of cured materials. The research results showed that, for the cured system with T-31, the compressive strength continued to increase, the flexural strength continued to increase, and the tensile strength first increased and then decreased (reaching its peak when the mass fraction of T-31 was 2.53%), the shear strength decreased, while the hardness of the material did not show significant changes. For the cured system with DMP-30, the compressive strength gradually decreased, the flexural strength gradually increased, the tensile strength reached its maximum at 1.25%, the shear strength decreased, while the hardness of the material reached its maximum at 1.25%, then gradually decreased and tended to stabilize. For the cured system with KH-560, the compressive strength and tensile strength gradually decreased with increasing content, the flexural strength reached its minimum at 2.53%, the shear strength decreased, while the hardness of the material showed a gradually decreasing trend. For the cured system with NDZ-201, the compressive strength and flexural strength decreased with increasing additive content, the tensile strength reached its minimum at 2.53%, the shear strength decreased, while the hardness of the material did not show significant changes. Therefore, the optimal dosage of additives needed to be determined comprehensively based on their functional positioning, performance goals, and specific resin curing system.

【Keywords】epoxy resin; polyamide resin; mechanical property; additive; curing

Development of 3,3',5,5'-tetramethyl-4,4'-diphenol diglycidylether

Xiong Gaohu^1,2, Zhang Liang^1,2, Qu Peng^1,2, Liu Yiwu¹

[1.Dongfang Feiyuan (Shandong) Electronic Materials Co., Ltd., Zibo 256300, Shandong, China; 2.Sichuan Dongshu New Materials Co., Ltd., Deyang  618000, Sichuan, China]

【Abstract】3,3',5,5'-tetramethyl-4,4'-diphenol diglycidylether (TMDE) has a high glass transition temperature and excellent heat resistance, and is widely used in composite materials, electronic packaging materials, and nonlinear optical materials.However, the production technology of TMDE in China is not yet perfect, and the products are mainly imported. A method for preparing 3,3',5,5'-tetramethyl-4,4'-biphenyldiol (TMBP) and TMDE was introduced in this article, and the optimal reaction conditions for preparing TMBP and TMDE from TMBP were provided, respectively. The research results showed that, ⑴It could be demonstrated through structural characterization and other methods that TMBP and TMDE had been successfully synthesized. ⑵ When the oxygen flow rate was 4.48 L/h (the ratio of 2,6-dimethylphenol to total oxygen introduced was 12:1) and the reaction temperature was 80 ℃, the highest yield of TMBP was 93.8%. ⑶ When the reaction ratio m(epichlorohydrin) : m(TMBP) was 2.82:1, the reaction temperature was 62 ℃, and the reaction pressure was 20 kPa, the indicators and consumption of TMDE products were optimal.

【Keywords】3,3',5,5'-tetramethyl-4,4'-diphenol diglycidylether; electronic packaging material; reaction condition