填充型有机硅基导热凝胶的制备和性能研究

尚田雨，张晨旭，任琳琳，曾小亮，孙  蓉

（深圳先进电子材料国际创新研究院，广东深圳  518100）

【摘 要】以有机硅基热界面材料为研究对象，使用不同黏度配比的硅油作为基体，并以氧化铝和氧化锌作为导热填料，制备了一系列填充型有机硅导热凝胶样品。分别研究了凝胶成分对材料力学性能、导热性能以及点胶性能等的影响。研究结果表明：所制备的有机硅导热凝胶的热导率主要受导热填料的影响，当高黏度乙烯基硅油占比为50%时，导热凝胶的各项性能良好，拉伸强度、断裂伸长率、邵氏硬度、热导率和挤出率分别达到0.37 MPa、184%、63.42、2.90 W/(m•K)和106.4 g/min。此外，本研究的导热凝胶样品在应对高温高湿环境和冷热循环试验表现良好，能满足行业要求，具备良好的应用前景和应用价值。

【关键词】热界面材料；硅凝胶；热导率；有机硅

非异氰酸酯聚氨酯固化剂的制备及性能研究

宋彩雨，郭宇婷，袁志刚，谢天怡，李金籽，孙明明，张  斌，张绪刚

(黑龙江省科学院石油化学研究院，黑龙江哈尔滨  150040)

【摘 要】以间苯二酚二缩水甘油醚为原料，通过CO₂插入法合成环碳酸酯化合物（RDGEC）。将其与聚醚胺（D230）聚合，调控比例，制备了系列非异氰酸酯聚氨酯（NIPU）固化剂。详细考察了NIPU与双酚A环氧树脂（E-51）共混体系的固化动力学，对固化试样的粘接性能、热机械性能、热稳定性及断裂面的微观状态进行了研究。研究结果表明：成功制备了RDGEC和系列NIPU固化剂；调控RDGEC与D230反应比例对NIPU的固化反应活性影响较小，但能够有效改变固化体系韧性程度，确定固化工艺为50 ℃/2 h + 100 ℃/2 h；NIPU与E-51混合固化体系对铝合金具有优异的粘接性能，调控RDGEC与D230比例至1∶1.75时，25 ℃剪切强度和70 ℃剪切强度分别为36.98和14.51 MPa，25 ℃下90°剥离强度达到6.08 kN/m，粘接性能达到最佳；该系列固化试样均表现出优异的热机械性能和热稳定性。

【关键词】非异氰酸酯聚氨酯；环氧固化；粘接性能；热稳定性

FPC用改性丙烯酸酯胶粘剂的固化研究

陈  伟^1,2，陈文求^1,2,3，余 洋^1,2，张雪平^1,2,3，李桢林^1,2,3，范和平^1,2,3

[1.华烁科技股份有限公司，湖北武汉  430074；2.华烁电子材料（武汉）有限公司，湖北武汉  430074；3.江汉大学湖北省化学研究院，湖北武汉  430056]

【摘 要】改性丙烯酸酯类胶粘剂应用于挠性印制电路板（FPC）及其基材时，其固化程度对性能有着决定性的影响。本文以自制的环氧树脂改性的丙烯酸酯类胶粘剂为例，通过动态差示扫描量热仪（DSC）从理论上分析其非等温固化的动力学行为，以研究其在室温时的储存稳定性和高温固化的工艺条件。然后通过傅里叶变换红外光谱仪（FT-IR）研究其在室温以及125~300 ℃温度范围内的固化反应历程，以保证该胶粘剂应用于FPC的热固性胶膜/片的固化性能或效果。研究结果表明：⑴通过非等温DSC测试，确定了改性丙烯酸酯胶粘剂的固化动力学方程，由此推算其在10~50 ℃的常规储存温度下的反应速率常数K值低至10^-5min^-1级别及以下，具有优异的B阶稳定性；同时在180 ℃及以上的K值达到10^-1 min^-1级别，可以满足其高温烘烤迅速固化的使用要求。⑵由动态DSC测试得到的三种特征温度，进而推算本胶膜的理论固化温度为182 ℃，且在此温度下实现100%固化需时约100 min，并通过DSC测试进行了验证。⑶通过FT-IR对比验证了以上高温固化的反应历程，其在200 ℃处理后环氧基基本反应完全，这与以上分析的结果一致。

【关键词】改性丙烯酸酯；胶粘剂；固化；性能；挠性印制电路板

单组分加成型导热硅胶的制备及其可靠性研究

徐玉文，刘良军，杨海兵，谢  翔

（东莞优邦材料科技股份有限公司，广东东莞  523837）

【摘 要】以中低黏度乙烯基硅油、含氢硅油搭配微米氧化铝导热粉体为原料，制备了两款单组分加成型导热硅胶（UB-5705和UB-5707）。通过红外光谱仪分析明确了所得产物，进一步利用差示扫描量热仪、热重分析仪及导热系数测试仪进行性能表征，并进行高温高湿、冷热循环和高温老化可靠性研究。研究结果表明：⑴导热硅胶合成效果良好，符合试验预期，热裂解温度（T_d）大于250 ℃，导热系数大于1.90 W/(m·K)，热阻低于10.184 ℃·cm²/W，剪切强度达5.00 MPa以上；⑵相比之下，UB-5705具有更优异的韧性，而UB-5707则具有更高的导热系数；⑶在分别经过1 000 h高温高湿、冷热循环和高温老化后，两款导热硅胶仍能保持较高的导热系数与机械性能，导热系数＞1.80 W/(m·K)，剪切/拉伸强度>4.0 MPa，断裂伸长率>20％，综合性能满足芯片与散热器组装可靠性要求。

【关键词】单组分；硅胶；加成型；高导热

H-MMT对低物质的量比脲醛树脂胶粘剂性能的影响

赵亚红¹，于晓芳²

（1.赤峰工业职业技术学院，内蒙古赤峰  024005；2.内蒙古农业大学材料科学与艺术设计学院，内蒙古呼和浩特  010018）

【摘 要】将蒙脱土进行酸化处理，制备酸化蒙脱土（H-MMT）。随后在低物质的量比脲醛树脂合成体系中，加入制得的H-MMT，得到经H-MMT改性的脲醛树脂胶粘剂。通过控制加入H-MMT的投料比以及投放时间，探究其对脲醛树脂胶粘剂的黏度、固含率、游离甲醛含量以及胶接性能的影响。同时，对比分析了未改性脲醛树脂胶粘剂和H-MMT改性脲醛树脂胶粘剂的差异。研究结果表明：在脲醛树脂合成体系反应的第二阶段加入3%的H-MMT，改性脲醛树脂胶粘剂的性能最好，测得胶粘剂的游离甲醛含量为0.17%，固化时间为57.5 s，胶接强度为1.1 MPa；加入H-MMT的改性脲醛树脂胶粘剂中含有大量的醚键和羟甲基基团，可以提高胶粘剂的胶接性能；H-MMT改性的脲醛树脂胶粘剂中存在着未反应的残留尿素，进一步降低了体系的游离甲醛含量。

【关键词】蒙脱土；脲醛树脂；胶粘剂；性能；结构

改良耐水性纤维素纳米纤维胶粘剂的制备及应用研究

尹生妹

（广州科技职业技术大学，广东广州  510550）

【摘 要】纤维素纳米纤维（CNF）作为一种生物质材料，其表面含有大量羟基，天然地对极性表面具有粘接能力，但只含有羟基的CNF粘接强度较低并且不易与水分子进行结合，影响了内聚力和黏附力。针对此现状，本研究根据聚乙烯亚胺（PEI）与单宁酸（TA）在极短时间内得到化学键，并能形成链缠结的特点，在CNF表面添加单宁酸，通过物理共混法制备了CNF-TA-PEI胶粘剂，并对胶粘剂的稳定性和耐水性进行了研究。研究结果表明：当m(TA)∶m(PEI)=60∶40时，虽然CNF-TA-PEI胶粘剂在水中浸泡时间达到了14 d，所测的粘接强度仍然高达(140.7±7.3) kPa。在浸泡超过21 d后，其粘接性能呈现出持续下降的趋势，直到时间为28 d时，测得的强度值是(61.9±1.4) kPa。以上结果表明，CNF-TA-PEI胶粘剂具有较好的界面黏附性和耐水性，在实际中具有一定的应用前景。

【关键词】纤维素纳米纤维；胶粘剂；单宁酸；聚乙烯亚胺

多异氰酸酯交联聚乙烯醇木材黏合剂的研究

潘  婵，龙一飞，赵军丽，郭晓琴

（武汉城市学院，湖北武汉  430075）

【摘 要】以聚乙烯醇溶液为基质，采用正交试验法（控制五水平六因素），探究非离子表面活性剂OP-10､催化剂辛酸亚锡､交联剂JQ-4的加入量、反应时间、反应温度和聚乙烯醇的相对体积的质量对改性聚乙烯醇木材黏合剂剪切强度的影响。研究结果表明：⑴正交试验所选的6个因素对胶粘剂的剪切强度都有影响，其中聚乙烯醇溶液的相对体积的质量影响最大。根据极差分析，影响胶粘剂固化因素的顺序为：PVA溶液相对体积的质量>OP-10加入量>JQ-4加入量>辛酸亚锡加入量>反应时间>反应温度。⑵黏合剂样品大体呈现均一的乳白色，所有样品颜色稳定性良好。黏合剂的稳定性好，不易变质，耐冻，易存储，流动性总体来说较优。⑶样品黏合剂的相对最佳合成条件：PVA加入量为8 g/100 mL，OP-10加入量为0.1 mL/100 mL，JQ-4加入量为0.3 mL/100 mL，催化剂加入量为0.3 mL/100 mL，反应时间为75 min，反应温度为60 ℃。所制备的乳液为稳定的乳白色，性能优异，可作为胶粘剂用于建筑行业，且更为环保。

【关键词】多异氰酸酯；聚乙烯醇；木材黏合剂

掺配高苯乙烯含量SIS对热熔压敏胶性能影响

朱金柱¹，曹秀生¹，冒  弘¹，周建东²

[1.台橡（南通）实业有限公司，江苏南通  226017；2.台橡宇部（南通）化学工业有限公司，江苏南通  226017]

【摘  要】以台橡SIS 4113作为SIS基热熔压敏胶热嵌段共聚物主体，掺配两种高苯乙烯含量SIS 4211和4411，通过熔融混合法制备SIS型热熔压敏胶。考察了不同高苯乙烯SIS掺配量变化对热熔压敏胶基础性能、黏着特性及流变性能的影响。研究结果表明：⑴随着掺混4211及4411比例的提高，热熔压敏胶的黏度降低、软化点升高，且掺混4411效果变化尤其明显，对于黏着性能、高温持粘性、剪切破坏温度均明显提升。⑵掺混4211的环形初粘力、180°剥离力稍有波动；而掺混4411对润湿性能影响较大，环形初粘力及180°剥离力均有明显降低。⑶流变曲线显示，掺混比例升高后，玻璃化转变温度（T_g）点及流动点逐渐升高，储能模量明显升高，与高温持粘测试结果对应。

【关键词】高苯乙烯含量SIS；热熔压敏胶；黏着性能；流变性能

建筑填充墙钢筋经无机胶粘剂加固后抗拉性能测试

倪 震

（南通电力设计院有限公司，江苏南通  226006）

【摘 要】由于建筑填充墙的结构形式和材料种类多样，经无机胶粘剂加固后，抗拉性能会发生变化。以重烧氧化镁、磷酸二氢钾、硼砂和粉煤灰为原料，制备不同配合比磷酸镁水泥（MPC）无机胶粘剂试件，测试建筑填充墙钢筋经无机胶粘剂加固后的抗拉性能。通过分析硼砂含量、氧化镁与磷酸二氢钾的物质的量之比（M/P）、粉煤灰含量对MPC无机胶粘剂抗拉强度、凝结时间的影响，确定最佳配合比。将其与玻璃纤维增强材料（GFRP）加固建筑填充墙试件，研究其抗拉性能。研究结果表明：硼砂用量为氧化镁质量的10%、M/P=5.5、粉煤灰量与氧化镁、磷酸二氢钾质量之和的比值为12%时，MPC无机胶粘剂的性能相对最佳；对建筑填充墙试件作加固处理，可有效提升其承载能力，S2试件的承载能力高于S1试件，抗拉性能更突出。

【关键词】建筑填充墙；无机胶粘剂；抗拉性能；配合比；凝结时间；抗拉强度

高掺量橡胶沥青技术发展与探讨

王寒冰，王仕峰

(上海交通大学化学化工学院，上海    200240)

【摘  要】高掺量橡胶沥青作为一种新型筑路技术，具有低温性能优异、耐久性能良好、胶粉消耗量大以及环境效益高等优势。为进一步推动高掺量橡胶沥青技术的应用，明晰其发展现状及需求，系统汇总了高掺量橡胶沥青的技术特性、胶体结构、性能评价、主流工艺、工程应用及问题。首先明确了高掺量橡胶沥青的含义，并对其不同于传统橡胶沥青的改性机理进行了阐述；其次，以化学反应的发生为判据，对比分析了现有物理手段及化学手段，并通过胶体结构变化进一步探索了高掺量橡胶沥青改性过程，结合其性能表现进行了结构性能分析；进而，围绕胶粉脱硫及沥青中熬制两类化学手段进行了深入阐述，总结评述了当下主流的高掺量橡胶沥青制备技术；最后，结合工程案例论述了高掺量橡胶沥青的可行性及优越性，并指出其存在的工程问题。

【关键词】道路工程；橡胶沥青；综述；高掺量；脱硫胶粉；胶体结构

环氧丙烯酸酯在厌氧胶中的应用研究进展

王新礼^1,2，汪  洋^1,2，马  创^1,2，宋金明^1,2，冯增辉^1,2，陶加法^1,2，刘秀生^1,2

(1.中国机械总院集团武汉材料保护研究所有限公司，特种表面保护材料及应用技术国家重点实验室，湖北武汉 430030；2.中国机械科学研究总院集团有限公司，北京 100080)

【摘 要】本文首先介绍了厌氧胶的组成，并以过氧化氢异丙苯-二甲基对甲苯胺-糖精引发体系为例，简要介绍了此引发体系的引发固化机制。其次，叙述了环氧丙烯酸酯的合成及相关的催化机理。进一步综述了环氧丙烯酸酯在厌氧胶中的应用，分析了环氧丙烯酸酯在提高厌氧胶强度和耐热性方面的优势。同时，探讨了不同力矩调节剂对性能的影响，以及改性环氧丙烯酸酯在厌氧胶中的应用研究。最后针对如何更好地利用环氧丙烯酸酯来提高厌氧胶的性能，提出了建议。

【关键词】厌氧胶; 环氧丙烯酸酯; 固化机制

Preparation and properties of filled silicone-based thermal conductive gel

Shang Tianyu, Zhang Chenxu, Ren Linlin, Zeng Xiaoliang, Sun Rong

（Shenzhen Institute of Advanced Electronic Materials, Shenzhen  518100, Guangdong, China）

【Abstract】Taking silicone-based thermal interface materials as the research object, a series of filled silicone thermal conductive gel samples were prepared by using silicone oil with different viscosity ratios as the matrix, and alumina and zinc oxide as the thermal conductive fillers. The effects of gel composition on the mechanical properties, thermal conductivity, dispensing properties of the materials were investigated, respectively. The research results showed that the thermal conductivity of the prepared silicone thermal conductive gel was mainly affected by the thermal conductive filler. When the proportion of high-viscosity vinyl silicone oil was 50%, the thermal conductive gel had good properties, with the tensile strength, elongation at break, Shore hardness, thermal conductivity and extrusion rate reaching 0.37 MPa, 184%, 63.42, 2.90 W/(m•K) and 106.4 g/min, respectively. In addition, the thermal conductive gel samples in this study performed well in high temperature and high humidity environments and in hot and cold cycle tests, which could meet the requirements of the industry and have good application prospects and application values.

【Keywords】thermal interface materials; silicone gel; thermal conductivity; organic silicone

Preparation and properties of non-isocyanate polyurethane curing agent

Song Caiyu, Guo Yuting, Yuan Zhigang, Xie Tianyi, Li Jinzi, Sun Mingming, Zhang Bin, Zhang Xugang

(Institute of Petrochemistry, Heilongjiang Academy of Sciences, Harbin 150040, Heilongjiang, China)

【Abstract】The cyclic carbonate compound (RDGEC) was synthesized by using resorcinol diglycidyl ether as raw material through CO₂ insertion method. A series of non-isocyanate polyurethane (NIPU) curing agent was prepared by polymerizing it with polyether amine (D230) and adjusting the ratio of reactants. The curing kinetics of the blended system of NIPU and bisphenol A epoxy resin (E-51) was investigated in details, and the bonding properties, thermal mechanical properties, thermal stability, and fracture surface microstructure of cured samples were studied. The research results showed that RDGEC and NIPU curing agent were prepared successfully. Adjusting the reaction ratio of RDGEC and D230 had little effect on the curing reactivity of NIPU, but the toughness degree of the curing system could be effectively changed, and the curing process was determined to be 50 ℃/2 h + 100 ℃/2 h. The blended curing system of NIPU and E-51 had excellent bonding properties on aluminum alloy. When adjusting the ratio of RDGEC and D230 to 1∶1.75, the shear strength at 25 ℃ and 70 ℃ were 36.98 and 14.51 MPa, respectively, the 90° peel strength at 25 ℃ reached 6.08 kN/m, with the bonding properties reaching the best. This series of cured samples exhibited excellent thermal mechanical properties and thermal stability.

【Keywords】non-isocyanate polyurethane; epoxy curing; bonding property; thermal stability

Study on curing of modified acrylate adhesive for FPC

Chen Wei^1,2, Chen Wenqiu^1,2,3, Yu Yang^1,2,Zhang Xueping^1,2,3, Li Zhenlin^1,2,3, Fan Heping^1,2,3

[1. HAISO Technology Co., Ltd., Wuhan 430074, Hubei, China; 2. HAISO EM (Wuhan) Ltd., Wuhan  430074, Hubei, China; 3. Hubei Research Institute of Chemistry, Jianghan University, Wuhan  430056, Hubei, China]

【Abstract】When modified acrylate adhesive was applied to flexible printed circuit board (FPC) and its substrates, the degree of curing had a decisive influence on the performance. In this paper, taking the self-made epoxy resin modified acrylate adhesive as an example, the kinetic behavior of its non-isothermal curing was analyzed theoretically by dynamic differential scanning calorimetry (DSC), in order to study its storage stability at room temperature and the process conditions of high temperature curing. Then, its curing reaction process at room temperature and the temperature range of 125-300 ℃ was investigated by Fourier transform infrared spectroscopy (FT-IR) to ensure the curing performance or effect of the adhesive applied to the thermosetting adhesive film/sheet of FPC. The research results show that, ⑴ The curing kinetics equation of the modified acrylate adhesive was determined by non-isothermal DSC test, from which it was deduced that its reaction rate constant K value was as low as the 10^-5 min^-1level and below under the conventional storage temperature of 10-50 ℃, exhibiting excellent B-order stability. At the same time, the K value at 180 ℃ and above reached the 10^-1 min^-1level, which could meet the requirements of rapid curing by high temperature baking. ⑵Based on three characteristic temperatures obtained from the dynamic DSC test, the theoretical curing temperature of this adhesive film was calculated to be 182 ℃, and it took about 100 min to realize 100% curing at this temperature, which was verified by DSC test. ⑶ The reaction process of the above high temperature curing was verified by FT-IR comparison, and the epoxy group was basically reacted completely after treatment at 200 ℃, which was consistent with the results of the above analysis.

【Keywords】modified acrylate; adhesive; curing; performance; flexible printed circuit board

Preparation and reliability study of single-component addition-type thermal conductive silica gel

Xu Yuwen, Liu Liangjun, Yang Haibing, Xie Xiang

(Dongguan U-Bond Technology Co., Ltd., Dongguan 523837, Guangdong, China)

【Abstract】Two kinds of single-component addition-type thermal conductive silica gel (UB-5705 and UB-5707) were prepared by using low to medium viscosity vinyl silicone oil, hydrogen containing silicone oil combined with micron alumina thermal conductive powder as raw materials. The obtained products were clarified by infrared spectrometer analysis, and further characterized by differential scanning calorimeter, thermogravimetric analyzer and thermal conductivity tester. High temperature and high humidity, hot and cold cycling, and high temperature aging reliability studies were also carried out. The research results showed that, ⑴The synthesis of thermal conductive silica gel was effective and met the test expectations. The thermal cracking temperature (T_d) was greater than 250 ℃, the thermal conductivity coefficient was greater than 1.90 W/(m·K), the thermal resistance was lower than 10.184 ℃·cm²/W, and the shear strength was more than 5.00 MPa. ⑵In contrast, UB-5705 had superior toughness, while UB-5707 had a higher thermal conductivity. ⑶After 1 000 h of high temperature and high humidity, cold and hot cycling and high temperature aging, respectively, two kinds of thermal conductive silica gel still maintained high thermal conductivity and mechanical properties, with thermal conductivity > 1.80 W/(m·K), shear/tensile strength > 4.0 MPa, the elongation at break > 20%. The comprehensive performance met the requirements for reliability of chip and radiator assembly.

【Keywords】single-component; silica gel; addition-type; high thermal conductivity

Effect of H-MMT on properties of low molar ratio urea-formaldehyde resin adhesive

Zhao Yahong¹, Yu Xiaofang²

(1. Chifeng Industrial Vocational Technical College, Chifeng  024005, Inner Mongolia, China; 2. College of Materials Science and Art Design, Inner Mongolia Agricultural University, Hohhot  010018, Inner Mongolia, China)

【Abstract】Acidified montmorillonite (H-MMT) was prepared by acidified treatment of montmorillonite. Then, the prepared H-MMT was added into the low molar ratio urea-formaldehyde resin synthesis system to obtain the urea-formaldehyde resin adhesive modified by H-MMT. The effects of H-MMT addition on the viscosity, solid content, free formaldehyde content and bonding properties of urea-formaldehyde resin adhesive were investigated by controlling the feeding ratio and release time.At the same time, the differences between unmodified urea-formaldehyde resin adhesive and those modified by H-MMT were compared and analyzed. The research results showed that in the second stage of the reaction in the urea-formaldehyde resin synthesis system, 3% H-MMT was added, and the performance of the modified urea-formaldehyde resin adhesive was the best. The free formaldehyde content of the adhesive was measured to be 0.17%, the curing time was 57.5 seconds, and the bonding strength was 1.1 MPa. The modified urea-formaldehyde resin adhesive with the addition of H-MMT contained a large number of ether bonds and hydroxymethyl groups, which could improve the bonding performance of the adhesive. The presence of unreacted residual urea in the H-MMT modified urea-formaldehyde resin adhesive further reduced the free formaldehyde content of the system.

【Keywords】montmorillonite; urea-formaldehyde resin; adhesive; property; structure

Preparation and application research of improved water-resistant cellulose nanofibers adhesive

Yin Shengmei

(Guangzhou Vocational University of Science and Technology, Guangzhou 510550, Guangdong, China)

【Abstract】Cellulose nanofibers (CNF), as a kind of biomass material, contain a large number of hydroxyl groups on their surface, which naturally have the ability to bond to polar surfaces. However, CNF containing only hydroxyl groups has low bonding strength and is not easy to bond with water molecules, which affects cohesion and adhesion. In response to this situation, in this study, based on the characteristics of chemical bonding between polyethyleneimine (PEI) and tannic acid (TA) in a very short time and the ability to form chain entanglement, tannic acid was added to the surface of CNF, CNF-TA-PEI adhesive was prepared through physical blending method, and the stability and water resistance of the adhesive were investigated. The research results showed that when m(TA) : m(PEI)=60:40, although CNF-TA-PEI adhesive was soaked in water for 14 days, the measured bonding strength still reached (140.7±7.3) kPa. After soaking for more than 21 days, its bonding performance showed a continuous downward trend, and the measured strength value was (61.9±1.4) kPa at 28 days. The above results indicated that CNF-TA-PEI adhesive had good interface adhesion and water resistance, and had certain application prospects in practice.

【Keywords】cellulose nanofibers; adhesive; tannic acid; polyethyleneimine

Study on polyisocyanate crosslinked polyvinyl alcohol wood adhesive

Pan Chan, Long Yifei,Zhao Junli, Guo Xiaoqin

（Wuhan City College, Wuhan  430075, Hubei, China）

【Abstract】The orthogonal experimental method (controlling five levels and six factors) was used to investigate the effect of the addition amount of nonionic surfactant OP-10, catalyst stannous octanoate, crosslinking agent JQ-4, the reaction time, the reaction temperature and the mass of relative volume of polyvinyl alcohol on the shear strength of modified polyvinyl alcohol wood adhesive by using polyvinyl alcohol solution as the matrix. The research results showed that, ⑴ All six factors selected in the orthogonal experiment had an effect on the shear strength of the adhesive, with the mass of relative volume of polyvinyl alcohol solution having the greatest effect. According to the range analysis, the order of factors affecting the adhesive curing was as follows:Mass of relative volume of PVA solution > OP-10 addition > JQ-4 addition > stannous octanoate addition > reaction time > reaction temperature. ⑵The adhesive sample generally showed a homogeneous milky white color, and the color stability of all samples was good. The adhesive had good stability, was not easy to deteriorate, freeze-resistant, easy to store, and the fluidity was generally superior. ⑶ The relative optimal synthesis conditions for the adhesive sample were: PVA addition of 8 g/100 mL, OP-10 addition of 0.1 mL/100 mL, JQ-4 addition of 0.3 mL/100 mL, catalyst addition of 0.3 mL/100 mL, reaction time of 75 minutes, and reaction temperature of 60 ℃.The prepared emulsion was stable milky white with excellent performance. It could be used as adhesive in the construction industry and was more environmentally friendly.

【Keywords】polyisocyanate; polyvinyl alcohol; wood adhesive

The influence of adding SIS with high styrene content on the performance of

hot melt pressure sensitive adhesive

Zhu Jinzhu¹,Cao Xiusheng¹,Mao Hong¹,Zhou Jiandong²

[1.TSRC (Nantong) Industries Ltd., Nantong 226017, Jiangsu, China; 2.TSRC-UBE (Nantong) Chemical Industrial Co., Ltd., Nantong 226017, Jiangsu, China]

【Abstract】Using TSRC SIS 4113 as the main body of hot block copolymer of SIS-based hot melt pressure sensitive adhesive, two kinds of SIS 4211 and 4411 with high styrene content were blended,and SIS type hot melt pressure sensitive adhesive was prepared by melt mixing method. The influence of different contents of SIS with high styrene on the basic properties, adhesion properties, and rheological properties of hot melt pressure sensitive adhesive was investigated. The research results showed that,⑴With the increase of the ratio of 4211 and 4411, the viscosity of hot melt pressure sensitive adhesive decreased and the softening point increased, while the effect of mixing 4411 changed significantly, the adhesion performance, high-temperature holding power, and shear failure temperature were all significantly improved. ⑵ The loop tack and 180° peel force after blending 4211 had slight fluctuations, the addition of 4411 had a significant impact on the wetting performance, with a significant decrease in the loop tack and 180° peel force. ⑶ The rheological curves showed that as the blending ratio increased, the glass transition temperature (T_g) point and flow point gradually increased, and the storage modulus significantly increased, corresponding to the results of the high-temperature holding power test.

【Keywords】SIS with high styrene content; hot melt pressure sensitive adhesive; adhesion performance; rheological performance